Abstract: A method of manufacturing an optical communication device includes preparing first and second pre-defined break lines in a carrier wafer. A first sub-mount is positioned near the first break line to accommodate an optical laser and a second sub-mount is positioned near the second break line to accommodate an optical modulator. The first sub-mount is secured to a thermally conductive and electrically nonconductive spacer which is secured to a thermo-electrical cooler that defines a gap between the first submount and the thermo-electrical cooler. A portion of the carrier wafer between the sub-mounts is removed.

Abstract: In one embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.

Abstract: A method of manufacturing an optical communication device aligns an optical sub-assembly and an optical modulator on a carrier wafer. A first sub-mount supports the optical sub-assembly and a second sub-mount supports the optical modulator. Pre-defined break lines are placed on the carrier wafer to accommodate separation of the sub-assembly and the optical modulator. The first sub-mount connects the optical sub-assembly to a thermoelectric cooler by either an epoxy, a spacer layer, or both. The optical sub-assembly is aligned in the x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer.

Abstract: In one embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.