Abstract: Methods and structures for a double-sided semiconductor structure using through-silicon vias (TSVs) are disclosed. The double-sided structure has functional circuits on both the front and back sides, interconnected by one or more TSVs. In some embodiments, multiple double-sided structures are combined to create 3D semiconductor structures with increased circuit density.

Abstract: A programming circuit of a phase change memory cell includes a controllable current generator to supply a programming pulse and an internal control unit coupled to the controllable current generator for stepwise modifying the programming pulse. The internal control unit, in turn, includes a control signal generator to provide the controllable current generator with a plurality of control signals. An oscillator provides a time reference signal and a driving module drives the control signal generator based on the time reference signal. As a result, a programming pulse with stepwise adjustable slope can be produced, including such a pulse with different leading and trailing edges.

Abstract: A programming circuit of a phase change memory cell includes a controllable current generator to supply a programming pulse and an internal control unit coupled to the controllable current generator for stepwise modifying the programming pulse. The internal control unit, in turn, includes a control signal generator to provide the controllable current generator with a plurality of control signals. An oscillator provides a time reference signal and a driving module drives the control signal generator based on the time reference signal. As a result, a programming pulse with stepwise adjustable slope can be produced, including such a pulse with different leading and trailing edges.

Abstract: The present invention discloses a method and system to optimize electrical interconnection of electrical components in a periphery area of a memory device thereby minimizing the periphery area. The periphery area is divided into a plurality of sub-circuits formed by selectively electrically connecting the electrical components. Electrical interconnection of the electrical components to form the sub-circuits is accomplished using a first metal layer and a second metal layer. The first metal layer is formed to create a plurality of first metal layer lines that are oriented to extend in substantially one direction on the memory device. The second metal layer is formed to create a plurality of second metal layer lines that are oriented to extend substantially perpendicular to the first metal layer lines.

Abstract: A method and system for controlling a boosted wordline voltage that is used during a read operation in a flash memory is disclosed by the present invention. In the preferred embodiment, a gate voltage is generated by a voltage booster in a wordline voltage booster circuit. An adjustable clamp circuit is electrically connected with the wordline voltage booster circuit for clamping the gate voltage that is generated by the voltage booster at a predetermined voltage level. The predetermined voltage level may be adjusted with a trimming circuit that is electrically connected to the adjustable clamp circuit, depending on process variations experienced during fabrication by the adjustable clamp circuit.

Abstract: A flash Electrically-Erasable Programmable Read-Only Memory (EEPROM) includes a plurality of field effect transistor memory cells, a power supply, and a controller which cooperates with the power supply to apply an erase pulse to the cells, and then erase verify a first byte of cells in each sector. If the first bytes in any sector has not passed erase verify, another erase pulse is applied to the cells of those sectors, and the first byte in each sector which did not pass erase verify the first time is erase verified again. This procedure is continued until the first byte in each sector has passed erase verify. Then, the sectors are processed in sequence to erase and erase verify every cell. First, an erase pulse is applied to all of the cells in the sector. Then, the first byte is erase verified. If the first byte passes erase verify (which it will because it did previously), the next byte is erase verified.

Abstract: A flash Electrically-Erasable Programmable Read-Only Memory (EEPROM) includes a plurality of floating gate transistor memory cells, a plurality of wordlines connected to the cells and a power supply for generating erase pulses. A controller controls the power supply to apply an erase pulse to all wordlines which are not deselected. Then, an erase verify procedure is applied to the cells in sequence. If all cells connected to a wordline pass the erase verify test, the wordline is deselected such that subsequent erase pulses will not be applied to the wordline and possibly cause the cells to become overerased. In one embodiment of the invention, erase verify is performed on all of the cells after an erase pulse is applied. The erase operation is completed when all cells pass erase verify. In another embodiment, erase verify is applied to each cell in sequence, with erase pulses being applied until each current cell passes erase verify. The wordlines can be deselected individually or in groups.

Abstract: A flash Electrically-Erasable Programmable Read-Only Memory (EEPROM) includes a plurality of floating gate transistor memory cells, a plurality of wordlines connected to the cells and a power source for generating a low power supply voltage on the order of 3 V or less. A wordline driver includes a booster for boosting the supply voltage to produce a wordline read voltage which is higher than the supply voltage, and applying the wordline voltage to a wordline. An upper clamp limits a maximum value of the wordline voltage to prevent read disturb. The upper clamp can be configured to reduce an amount by which the maximum value varies with the supply voltage, or to limit the maximum value to substantially a predetermined value.

Abstract: The present invention discloses a memory wordline decoder that includes a plurality of pre-decoded address lines that are electrically connected with a global x-decoder. A sub x-decoder is electrically connected with the global x-decoder for receiving electrical control signals from the global x-decoder. A memory sector is electrically connected with the sub x-decoder. The global x-decoder selectively controls the sub x-decoder to select a plurality of wordlines in the memory sector. A vertical x-decoder is electrically connected with the global x-decoder and the sub x-decoder. The vertical x-decoder is used to select a predetermined wordline by the global x-decoder during operation.

Abstract: A flash Electrically-Erasable Programmable Read-Only Memory (EEPROM) includes a plurality of field effect transistor memory cells each having a source, drain, floating gate and control gate, and a power source for supplying a plurality of voltages to the cells. A controller controls the power source to apply at least one erase pulse to the cells. Then, at least one overerase correction or "soft programming" pulse is applied to the cells during which the source, drain and control gate voltages of the cells are such that the threshold voltages of overerased cells will be increased, but least erased cells will not be disturbed. The overerase correction pulses thereby tighten the threshold voltage distribution. A source to substrate bias voltage is applied for the duration of the overerase correction pulses which reduces the background leakage of the cells to a level at which the overerase correction operation can be effectively performed, even in applications with low supply voltages.

Abstract: A flash Electrically-Erasable Programmable Read-Only Memory (EEPROM) includes a semiconductor substrate, and a plurality of field effect transistor memory cells each having a source, drain, floating gate and control gate formed on the substrate. A controller controls a power source to apply an operational pulse to the drain of a cell, and apply a source to substrate bias voltage to the cell while the operational pulse is being applied thereto, the bias voltage having a value selected to reduce or substantially eliminate leakage current in the cell. The operational pulse can be an overerase correction pulse. In this case, a voltage which is substantially equal to the bias voltage is applied to the control gate for the duration of the overerase correction pulse. The operational pulse can also be a programming pulse. In this case, a voltage which is higher than the bias voltage is applied to the control gate of the selected wordline for the duration of the programming pulse.

Abstract: An over-erased bit correction structure is provided for performing a correction operation on over-erased memory cells in an array of flash EEPROM memory cells during programming operations so as to render high endurance. Sensing circuitry (23) is used to detect column leakage current indicative of an over-erased bit. If an over-erased bit is determined, a pulse counter (25) is activated so as to apply programming pulses to the control gate of the selected memory cell so as to program back the negative threshold voltage of the over-erased bit to a positive voltage.