Patents by Inventor Ravindra Bhatkal

Ravindra Bhatkal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature high reliability alloy for solder hierarchy
    Patent number: 10322471
    Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: June 18, 2019
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Ravindra Bhatkal, Bawa Singh
  • Joining to aluminum
    Patent number: 10065274
    Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: September 4, 2018
    Inventors: Ranjit Pandher, Bawa Singh, Rahul Raut, Sanyogita Arora, Ravindra Bhatkal, Bin Mo
  • Low Temperature High Reliability Alloy for Solder Hierarchy
    Publication number: 20170197281
    Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.
    Type: Application
    Filed: July 15, 2015
    Publication date: July 13, 2017
    Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Ravindra Bhatkal, Bawa Singh
  • JOINING TO ALUMINIUM
    Publication number: 20160175994
    Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminium surfaces solderable using the flux and conventional solders.
    Type: Application
    Filed: August 29, 2014
    Publication date: June 23, 2016
    Applicant: ALPHA METALS, INC.
    Inventors: Ranjit Pandher, Bawa Singh, Rahul Raut, Arora Sanyogita, Ravindra Bhatkal, Bin Mo