Patents by Inventor Ravindra RAGHAVENDRA
Ravindra RAGHAVENDRA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955347Abstract: One or more electronic devices that are mounted on a substrate, including at least one cooling plate in contact with the one or more electronic devices, are encapsulated. The substrate is clamped between a first mold half and a second mold half which define a molding cavity for molding the one or more electronic devices. A cavity insert movably located in the first mold half is projected into the cavity in order to contact and apply a sealing pressure onto the at least one cooling plate. After introducing a molding compound into the cavity at a first fill pressure, the molding compound in the cavity is packed by applying a second fill pressure which is higher than the first fill pressure. During this time, the sealing pressure is maintained at values that are higher than the first fill pressure and the second fill pressure.Type: GrantFiled: December 2, 2021Date of Patent: April 9, 2024Assignee: ASMPT SINGAPORE PTE. LTD.Inventors: Teng Hock Kuah, Yi Lin, Ravindra Raghavendra, Kar Weng Yan, Angelito Barrozo Perez
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Publication number: 20230178382Abstract: One or more electronic devices that are mounted on a substrate, including at least one cooling plate in contact with the one or more electronic devices, are encapsulated. The substrate is clamped between a first mold half and a second mold half which define a molding cavity for molding the one or more electronic devices. A cavity insert movably located in the first mold half is projected into the cavity in order to contact and apply a sealing pressure onto the at least one cooling plate. After introducing a molding compound into the cavity at a first fill pressure, the molding compound in the cavity is packed by applying a second fill pressure which is higher than the first fill pressure. During this time, the sealing pressure is maintained at values that are higher than the first fill pressure and the second fill pressure.Type: ApplicationFiled: December 2, 2021Publication date: June 8, 2023Inventors: Teng Hock KUAH, Yi LIN, Ravindra RAGHAVENDRA, Kar Weng YAN, Angelito Barrozo PEREZ
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Publication number: 20180117813Abstract: The invention provides a molding apparatus comprising a first mold part operative to hold a semiconductor substrate, and a second mold part having a main surface facing the first mold part. The first and second mold parts are movable relative to each other between an open arrangement and a closed arrangement. The main surface comprises portions defining a mold cavity, and a recess at least partially surrounding the mold cavity. The main surface also comprises a compressible structure located within the recess, wherein at least a portion of the compressible structure extends out of the recess towards the first mold part and is compressible into the recess when the compressible structure contacts the semiconductor substrate in the closed arrangement. The second mold part also comprises one or more air conduits operative to introduce compressed air into the mold cavity.Type: ApplicationFiled: November 2, 2016Publication date: May 3, 2018Inventors: Shu Chuen HO, Teng Hock KUAH, Jiapei DING, Jian Xiong SU, Ravindra RAGHAVENDRA
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Patent number: 9427893Abstract: Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the center of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.Type: GrantFiled: September 18, 2014Date of Patent: August 30, 2016Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Jian Xiong Su, Teng Hock Kuah, Shu Chuen Ho, Jiapei Ding, Ravindra Raghavendra
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Publication number: 20160082624Abstract: Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the centre of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.Type: ApplicationFiled: September 18, 2014Publication date: March 24, 2016Inventors: Jian Xiong SU, Teng Hock KUAH, Shu Chuen HO, Jiapei DING, Ravindra RAGHAVENDRA
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Patent number: 9279185Abstract: A feed-through apparatus for a chemical vapor deposition device including: a feed-through main body; a plurality of runner units; and a feed-through device rotatable with respect to the plurality of runner units within the feed-through main body. Each runner unit has a fluid inlet and an elongated runner for receiving the fluid from the fluid inlet wherein the elongated runner extends spirally on a surface of the runner unit. The feed-through device has a plurality of feed-through device orifices for receiving fluids from corresponding elongated runners during rotation of the feed-through device and has outlet-orifices for releasing the fluids into a reactor chamber.Type: GrantFiled: June 14, 2012Date of Patent: March 8, 2016Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Zilan Li, Teng Hock Kuah, Chidambaram Palaniappan, Ravindra Raghavendra
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Publication number: 20140284404Abstract: Disclosed is a chemical vapour deposition injector 100, comprising a gas injector body 104 having a plurality of holes for directing a first gas from a first gas plenum into respective first gas channels of the gas injector body, each first gas channel extending in a first direction and arranged to branch into separate flow paths; a plurality of discrete first conduits, each first conduit being arranged to connect to a respective one of the discrete flow paths for carrying the first gas to a reaction chamber; a second gas channel for directing a second gas from a second gas plenum into the gas injector body, the second gas channel having a longitudinal axis which extends in a second direction transverse to the first direction; and a plurality of discrete second conduits coupled to the second gas channel and arranged to carry the second gas from the second gas channel to the reactor chamber; wherein at least some of the discrete second conduits are arranged between the discrete first conduits.Type: ApplicationFiled: March 20, 2013Publication date: September 25, 2014Applicant: ASM Technology Singapore Pte Ltd.Inventors: Teng Hock KUAH, Hongbo LIU, Jiuan WEI, Wentao WANG, Jingsheng CHEN, Jiapei DING, Ravindra RAGHAVENDRA, Bubesh Babu JOTHEESWARAN, Meer Saiful HASSAN
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Patent number: 8840726Abstract: An apparatus 101 for depositing a thin-film onto a surface of a substrate 113 using precursor gases G1, G2 is disclosed. The apparatus 101 comprises i) a supporting device 111 for holding the substrate 113; and ii) a spinner 105 positioned adjacent to the supporting device 111. Specifically, the spinner 105 includes a hub 106 for connecting to a motor, and one or more blades 201 connected to the hub 106. In particular, the one or more blades 201 are operative to rotate around the hub 106 on a plane to drive a fluid flow of the precursor gases G1, G2, so as to distribute the precursor gases G1, G2 across the surface of the substrate 113.Type: GrantFiled: June 8, 2011Date of Patent: September 23, 2014Assignee: ASM Technology Singapore Pte LtdInventors: Zilan Li, Teng Hock Kuah, Jiapei Ding, Ravindra Raghavendra
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Publication number: 20130333620Abstract: A feed-through apparatus for a chemical vapor deposition device including: a feed-through main body; a plurality of runner units; and a feed-through device rotatable with respect to the plurality of runner units within the feed-through main body. Each runner unit has a fluid inlet and an elongated runner for receiving the fluid from the fluid inlet wherein the elongated runner extends spirally on a surface of the runner unit. The feed-through device has a plurality of feed-through device orifices for receiving fluids from corresponding elongated runners during rotation of the feed-through device and has outlet-orifices for releasing the fluids into a reactor chamber.Type: ApplicationFiled: June 14, 2012Publication date: December 19, 2013Inventors: Zilan LI, Teng Hock KUAH, Chidambaram PALANIAPPAN, Ravindra RAGHAVENDRA
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Publication number: 20120312231Abstract: An apparatus 101 for depositing a thin-film onto a surface of a substrate 113 using precursor gases G1, G2 is disclosed. The apparatus 101 comprises i) a supporting device 111 for holding the substrate 113; and ii) a spinner 105 positioned adjacent to the supporting device 111. Specifically, the spinner 105 includes a hub 106 for connecting to a motor, and one or more blades 201 connected to the hub 106. In particular, the one or more blades 201 are operative to rotate around the hub 106 on a plane to drive a fluid flow of the precursor gases G1, G2, so as to distribute the precursor gases G1, G2 across the surface of the substrate 113.Type: ApplicationFiled: June 8, 2011Publication date: December 13, 2012Inventors: Zilan LI, Teng Hock KUAH, Jiapei DING, Ravindra RAGHAVENDRA