Abstract: An improved package for a semiconductor device. The semiconductor device includes an apparatus having at least two access leads to facilitate electrical connection of the apparatus within an electrical circuit. The package has generally a closed polyhedral shape presenting a plurality of faces and substantially insulatingly surrounding the apparatus in a manner leaving the access leads exposed for effecting electrical connection. The access leads extend a distance from exit loci from the package. The exit loci are situated on an exit face of the package, adjacent pairs of exit loci being generally in a common plane. An intraplanar distance within the common plane is established intermediate each adjacent pair of the exit loci. The improvement comprises configuring the exit face to establish an on-surface path greater than the intraplanar distance intermediate selected adjacent pairs of the exit loci.

Abstract: A modular power supply and a method of operating the same to accept either AC or DC input power. In one embodiment, the modular power supply includes an input module that accepts input power and employs at least one main power switch and a step-up transformer to provide intermediate power at an enhanced voltage at an output thereof. The modular power supply also includes a power transfer conductor coupled to the output. The modular power supply further includes an output module, having an input coupled to the conductor, that accepts the intermediate power and employs a step-down transformer and an output rectifier to provide DC output power at a voltage that is less than the enhanced voltage. The modular power supply still further includes a diode, coupled to the input and output modules, that prevents the step-up and step-down transformers from saturating.