Abstract: A cytometer includes a plurality of measurement sections, each comprising first and second sidewalls and a base therebetween, the sidewalls and base defining a channel portion extending from an entrance to an exit; an electrode group arranged on the opposite sides of the base and part way between the entrance and exit, the electrode group comprising an upstream electrode, a centre electrode and a downstream electrode in the way of a trajectory between the entrance and exit, and in respective order; the measurement sections being connected together to form at least one measurement channel comprising a plurality of the channel portions connected together in series; and, a lock-in amplifier; the central electrode of each group connected to the excitation signal port of the lock-in amplifier, and the upstream and downstream electrodes connected to the voltage differential input ports of the lock-in amplifier.

Abstract: An IGBT module includes a heat dissipation base plate. A first ceramic heat dissipation element is embedded in the heat dissipation base plate. A first wiring layer is provided on the surface of the heat dissipation base plate. The first side of an IGBT chip is mounted onto the first wiring layer. The second side of the IGBT chip is provided with a heat conductive metal plate. A first heat dissipation plate having a first through hole is provided on a side of the first wiring layer. The IGBT chip and the heat conductive metal plate are located in the first through hole. A second wiring layer is provided on a side of the first heat dissipation plate away from the IGBT chip. The second wiring layer is provided on a side of the heat conductive metal plate.

Abstract: An IGBT module includes a heat dissipation base plate. A first ceramic heat dissipation element is embedded in the heat dissipation base plate. A first wiring layer is provided on the surface of the heat dissipation base plate. The first side of an IGBT chip is mounted onto the first wiring layer. The second side of the IGBT chip is provided with a heat conductive metal plate. A first heat dissipation plate having a first through hole is provided on a side of the first wiring layer. The IGBT chip and the heat conductive metal plate are located in the first through hole. A second wiring layer is provided on a side of the first heat dissipation plate away from the IGBT chip. The second wiring layer is provided on a side of the heat conductive metal plate.

Abstract: The present invention provides a device module embedded with switch chip and a manufacturing method thereof, the device module includes: a double-sided circuit board, the first surface of the double-sided circuit board is provided with first pads, and the second surface opposite to the first surface is provided with second pads; a heat dissipation substrate embedded with an electric insulation heat dissipation body and arranged at a side of the first surface of the double-sided circuit board; a switch chip embedded in a heat dissipation substrate, the pins of the switch chip are soldered to the first pads, and the other side of the switch chip opposite to the side of the pins is thermally connected to the electric insulation heat dissipation body; energy storage device, whose pins are soldered to the second pads.

Abstract: Disclosed is a power module with built-in power device and double-sided heat dissipation and a manufacturing method thereof. The power module includes a first base plate including a first organic insulating base material, a first electrical insulating heat dissipation body, a first metal layer, and a patterned second metal layer; a second base plate including a second organic insulating base material and a second electrical insulating heat dissipation body. A third metal layer thermally connected to a side of the second electrical insulating heat dissipation body is formed at the outer side of the second base plate. A fourth metal layer thermally connected to the second electrical insulating heat dissipation body is formed at another side of the second electrical insulating heat dissipation body. The fourth metal layer is formed with a concave power device accommodating space, and the power device is arranged in the accommodating space.

Abstract: A method and system for allocating memory in a RAID system. A RAID system requires the use of shared memory to store processed data related to operations of different mass storage devices. Certain RAID algorithms require different sizes of memory regions of the memory, and multiple requests to lock the required memory regions are therefore required. As multiple requests are made in parallel for different operations, the multiple requests for each operation are sorted in a predetermined order. This ensures that all memory regions for one operation can be locked. Requests for memory regions locked by a second operation are held in a pending state to wait for release of those memory regions by a first operation, at which point they are locked again by the second operation.

Abstract: A controller comprising a transport layer, an internal memory, and a link list manager block. The internal memory stores pending instruction entries. The link list manager block is configured to read instructions stored in an external memory, update an active vector, the active vector for storing indications of instructions from the external memory; update the pending instruction entries in the internal memory; and update the instructions stored in the external memory. The link list manager block configured to dispatch a instruction from the pending instruction entries in the internal memory to the transport layer.

Abstract: A method of chaining a plurality of engines for a system on chip (SOC) controller device and a SOC controller device are disclosed herein. The method comprises: generating, at an initiator, a super-descriptor for providing instructions to the plurality of engines of the SOC controller; passing the super-descriptor from the initiator to a first engine of the plurality of engines; and executing a portion of the super-descriptor at each of the plurality of engines in series without the intervention of the initiator.

Abstract: A computer-implemented system and method of intra-oral analysis for measuring plaque removal is disclosed. The system includes hardware for real-time image acquisition and software to store the acquired images on a patient-by-patient basis. The system implements algorithms to segment teeth of interest from surrounding gum, and uses a real-time image-based morphing procedure to automatically overlay a grid onto each segmented tooth. Pattern recognition methods are used to classify plaque from surrounding gum and enamel, while ignoring glare effects due to the reflection of camera light and ambient light from enamel regions. The system integrates these components into a single software suite with an easy-to-use graphical user interface (GUI) that allows users to do an end-to-end run of a patient record, including tooth segmentation of all teeth, grid morphing of each segmented tooth, and plaque classification of each tooth image.

Abstract: Compositions containing strontium fortified calcium nanoparticles and/or microparticles, and methods of making and using thereof are described herein. The strontium fortified calcium compounds contain calcium ions, calcium atoms, strontium ions, strontium atoms, and combinations thereof and one or more anions. Exemplary anions include, but are not limited to, citrate, phosphate, carbonate, and combinations thereof. The particles can be formulated for enteral or parenteral administration by incorporating the particles into a pharmaceutically carrier. The compositions can further contain one or more active agents useful for bone diseases or disorders, such as vitamin D, growth factors, and combinations thereof. The compositions can be used to treat or prevent one or more bone diseases or disorders of the bone, such as osteoporosis. Alternatively, the particles can be coated onto a substrate, such as the surface of an implant.