Patents by Inventor Raymond Louis Dietz

Raymond Louis Dietz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High thermally conductive polymeric adhesive
    Patent number: 6265471
    Abstract: A thermosetting adhesive paste exhibiting a high thermal conductivity suitable for die attach applications.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: July 24, 2001
    Assignee: Diemat, Inc.
    Inventor: Raymond Louis Dietz
  • Polymeric adhesive paste
    Patent number: 6140402
    Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
    Type: Grant
    Filed: March 24, 1997
    Date of Patent: October 31, 2000
    Assignee: Diemat, Inc.
    Inventors: Raymond Louis Dietz, David Martin Peck
  • Polymeric adhesive paste
    Patent number: 6111005
    Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
    Type: Grant
    Filed: January 30, 1996
    Date of Patent: August 29, 2000
    Assignee: Diemat, Inc.
    Inventors: Raymond Louis Dietz, David Martin Peck