Abstract: A flip chip mounting board includes a substrate having a top surface and a plurality of generally parallel, longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. A first strip of laterally extending solder resist material overlies the first longitudinal end portions of the bond fingers. The first strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps with a longitudinally extending tooth portion being aligned with every other one of the bond fingers. Adjacent bond fingers have first end portions covered by different longitudinal lengths of solder resist material.

Abstract: Disclosed herein is a warp detection system (200) for determining warping in a carrier (110) configured to carry substrates (120) for processing. In one embodiment, the system (200) includes a guide plate (210) configured to guide a path of the carrier (110) during the processing, where the guide plate (210) is positioned underneath the carrier (110). In addition, the system (220) includes a plurality of sensors (230) positioned within the guide plate (210), wherein each of the plurality of sensors (230) is configured to measure a distance of a respective area of the carrier (110) from the guide plate (210). Also in this embodiment, the system (200) includes a processing device (310) configured to receive the measured distances and determine warping in the carrier (110) based on differences between the measured distances.

Abstract: An improved bond integrity test system is provided by eliminating the spring loaded wire spool cover which contributes to particulate matter, and by addition of a second contact diverter in the wire path. These improvements have been shown to decrease false lifted ball bond reports by 68%, and therefore to improve productivity and accuracy of the test system. Such changes are readily adapted to current bonders, as well as to new designs.