Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.

Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.

Abstract: A camera lens suspension assembly includes a support member including a support metal base layer formed from a first unitary metal component, comprising a bearing plate portion in the support metal base layer. The assembly also includes a moving member including a moving metal base layer formed from a second unitary metal component and mounted to the support member, comprising a moving plate portion in the moving metal base layer, and flexure arms in the moving metal base layer extending from the moving plate portion and coupled to the support member. The assembly further includes a plurality of bearing-retaining recess between the bearing plate portion of the support member and the moving plate portion of the moving member, and ball-bearings within the bearing-retaining recesses, and between and engaging the bearing plate portion and the moving plate, to enable movement of the moving member with respect to the support member.

Abstract: A camera lens suspension assembly includes a support member including a support metal base layer formed from a first unitary metal component, comprising a bearing plate portion in the support metal base layer. The assembly also includes a moving member including a moving metal base layer formed from a second unitary metal component and mounted to the support member, comprising a moving plate portion in the moving metal base layer, and flexure arms in the moving metal base layer extending from the moving plate portion and coupled to the support member. The assembly further includes a plurality of bearing-retaining recess between the bearing plate portion of the support member and the moving plate portion of the moving member, and ball-bearings within the bearing-retaining recesses, and between and engaging the bearing plate portion and the moving plate, to enable movement of the moving member with respect to the support member.

Abstract: A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and the electrically conductive layer. A plurality of electrically conductive traces with bond pads are formed in the electrically conductive layer. A feature datum is also formed in the electrically conductive layer on a detachable carrier strip. The feature datum defines a first edge in the electrically conductive layer parallel to an edge of the bond pads.

Abstract: A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and the electrically conductive layer. A plurality of electrically conductive traces with bond pads are formed in the electrically conductive layer. A feature datum is also formed in the electrically conductive layer on a detachable carrier strip. The feature datum defines a first edge in the electrically conductive layer parallel to an edge of the bond pads.

Abstract: A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and the electrically conductive layer. A plurality of electrically conductive traces with bond pads are formed in the electrically conductive layer. A feature datum is also formed in the electrically conductive layer on a detachable carrier strip. The feature datum defines a first edge in the electrically conductive layer parallel to an edge of the bond pads.

Abstract: A baseplate for swaging a head suspension to an actuator arm includes a flange with an opening having a back bore diameter and a boss tower extending from the flange and having an outer diameter. The back bore diameter is less than or equal to about 105% of the outer diameter and greater than or equal to about 90% of the outer diameter.

Abstract: A head suspension for a reverse flow disk drive. The head suspension includes a load beam having a mounting region at a proximal end, a rigid region at a distal end and a spring region between the mounting region and the rigid region. A flexure is mounted on the distal end of the rigid region. A slider is mounted on the flexure. The slider has a proximal end closest to the proximal end of the load beam, wherein the spring region, the rigid region, the flexure and the slider comprise an active portion. One or more read/write heads are located on the proximal end of the slider. A plurality of electrical traces extend along the head suspension to the proximal end of the slider. At least one airflow attenuator is provided that creates a region of reduced airflow velocity proximate at least a portion of the active portion. An actuator assembly and to a reverse flow disk drive are also disclosed.

Abstract: A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.

Abstract: A head suspension or head suspension component for use in supporting a read/write head in a storage device, the head suspension or head suspension component including an integrated circuit chip as a structural element of the head suspension or head suspension component. The chip is included as part of a load beam or as a stiffener for a load beam. A flexure or other gimballing device is mounted to the chip or to a portion of the load beam that is mounted to the chip. The chip may be configured for improved heat dissipation or resonant characteristics. The chip is mounted to head suspension components in various ways, including the use of attachment features formed in the chip. A method of making a head suspension or head suspension component that includes mounting a chip as a structural element of the head suspension or head suspension component is also included.

Abstract: A head suspension or head suspension component article configured for solder ball bonding of a head slider to electrical traces on article. The article including electrical traces formed from electrically conductive material with the electrical traces having a bonding region adapted for electrical bonding to a head slider. Also included is a support structure providing support for at least portions of the electrical traces and including a head slider mounting region adapted to receive the head slider. This structure is configured to mechanically and thermally isolate the bonding region of the electrical traces from the head slider mounting region to reduce mechanical and thermal effects of a solder ball bonding process on the article during solder ball bonding of the head slider to the electrical traces. The support structure may be reduced at or around the bonding region, or the conductive material may be increased to dissipate more heat.

Abstract: A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.

Abstract: A head suspension for supporting a head slider over a rigid disk in a dynamic storage device having a component that includes a compliant feature adapted to engage a first pin and a datum engaging surface spaced from the compliant feature. The component being locatable relative to a datum by manipulation of the component with respect to the datum and a first pin to cause the first pin to engage and deflect the compliant feature when the datum engaging surface of the component is engaged and positioned with respect to the datum. The head suspension also including a second component having a pin engaging feature and possibly a datum engaging surface alignable with the compliant feature and datum engaging surface of the first component, respectively. The pin engaging feature of the second component being compliant or non-compliant.

Abstract: A method for aligning head suspension structures minimize to misalignments between a flexure and a load beam of the head suspension. The load beam and the flexure of the head suspension include a first aperture formed near a load point dimple of the head suspension to provide a reference datum. An elongated alignment aperture is formed in the rigid region of the load beam, and a proximal alignment aperture and a distal alignment aperture are formed in the flexure. The elongated the aperture overlaps at least a portion of the proximal and distal alignment apertures in such a manner that the proximal perimeter edge of the elongated aperture encroaches on the proximal alignment aperture and the proximal perimeter edge of the distal alignment aperture encroaches upon the elongated alignment aperture.

Abstract: A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.

Abstract: A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.

Abstract: A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.

Abstract: A head suspension for a rigid disk drive comprising one or more tapered processing holes in the load beam. The tapered processing holes can be located in the rigid region, the flexure or the mounting region. The tapered processing holes have a first diameter at a first surface of the load beam and a second diameter at a second surface of the load beam, wherein the first diameter is less than the second diameter. A method of processing a head suspension for a rigid disk drive is also disclosed. A processing tool is operatively engaging with the tapered processing hole to perform one of mechanically or optically locating, measuring. mounting, and/or aligning a suspension arm or components thereof.

Abstract: A head suspension for supporting a head slider over a rigid disk in a dynamic storage device having a component that includes a compliant feature adapted to engage a first pin and a datum engaging surface spaced from the compliant feature. The component being locatable relative to a datum by manipulation of the component with respect to the datum and a first pin to cause the first pin to engage and deflect the compliant feature when the datum engaging surface of the component is engaged and positioned with respect to the datum. The head suspension also including a second component having a pin engaging feature and possibly a datum engaging surface alignable with the compliant feature and datum engaging surface of the first component, respectively. The pin engaging feature of the second component being compliant or non-compliant.