Patents by Inventor Raymond Robert Horton
Raymond Robert Horton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6734363Abstract: The invention provides a wiring conductor for densely packed electronic apparatus, on which there is a supporting body of a material with randomly intertwined and fused filaments with spacing for being permeated by a coolant. The filamentary body material in addition may have imparted thereto the physical properties of interdependent density and permeability, noncorrosiveness and electrical conductivity.Type: GrantFiled: December 4, 1998Date of Patent: May 11, 2004Assignee: International Business Machines CorporationInventors: Raymond Robert Horton, Ismail Cevdet Noyan, Michael Jon Palmer, William Edward Pence, IV
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Patent number: 6697037Abstract: A matrix addressed display system designed so as to enable data line repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line repair utilizes additional data driver outputs, a defect map memory in the TFT/LCD module and modification of the data stream to the data drivers by additional circuits between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.Type: GrantFiled: April 29, 1996Date of Patent: February 24, 2004Assignee: International Business Machines CorporationInventors: Paul Matthew Alt, Pedro A. Chalco, Bruce Kenneth Furman, Raymond Robert Horton, Chandrasekhar Narayan, Benal Lee Owens, Jr., Kevin Wilson Warren, Steven Lorenz Wright
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Patent number: 6326696Abstract: An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.Type: GrantFiled: February 4, 1998Date of Patent: December 4, 2001Assignee: International Business Machines CorporationInventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Joseph Maryan Milewski, Lawrence S. Mok, Robert Kevin Montoye, Hussain Shaukatulla
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Patent number: 6306686Abstract: An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.Type: GrantFiled: January 19, 2000Date of Patent: October 23, 2001Assignee: International Business Machines CorporationInventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Joseph Maryan Milewski, Lawrence S. Mok, Robert Kevin Montoye, Hussain Shaukatulla
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Patent number: 6295128Abstract: In alignment of superpositioned objects on opposing substrates accuracy and simplicity is achieved through relative movement of the substrates responsive to an image of one object reflected from the surface of the opposite substrate. Alignment of mating fine pitch conductors and pads for bonding is achieved by observation of the reflection of one conductor or pad in the surface of the opposite substrate and relatively moving the substrates to eliminate the reflection.Type: GrantFiled: June 7, 1995Date of Patent: September 25, 2001Assignee: International Business Machines CorporationInventors: Raymond Robert Horton, Chandrasekhar Narayan, Michael Jon Palmer
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Patent number: 6029881Abstract: A principle of surface interlocking wherein the imperfections of two parallel surfaces deform and interlock under pressure. The surface interlocking enables the combination of a bridging element and a bonding tip of a diffusion bonding apparatus to pick up, transport, position at a unique location, and bond the bridging element in place to the conductors or pads. In the invention a single point bonding tip as part of a bonding apparatus is used to pick up the, to be, bridging metal object transport it to the bonding site and perform the entire bridging bonding operation all in one sequence of steps.Type: GrantFiled: February 6, 1997Date of Patent: February 29, 2000Assignee: International Business Machines CorporationInventors: Pedro A. Chalco, Bruce Kenneth Furman, Raymond Robert Horton, Chandrasekhar Narayan
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Patent number: 5948286Abstract: Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic energy pulse, delivered through a cleaved optical fiber end and closed end tip, that produces a heat increment in excess of the steady state manufacturing design temperature for the assembly and which is applied directly at the bond interface.Type: GrantFiled: February 6, 1997Date of Patent: September 7, 1999Assignee: International Business Machines CorporationInventors: Pedro A. Chalco, Raymond Robert Horton, Chandrasekhar Narayan, Michael Jon Palmer
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Patent number: 5915462Abstract: A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity.Type: GrantFiled: May 6, 1997Date of Patent: June 29, 1999Assignee: International Business Machines CorporationInventors: Bernardo Hernandez, Raymond Robert Horton, Ismail Cevdet Noyan, Michael Jon Palmer
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Patent number: 5847926Abstract: The invention provides lightweight packaging of portable electronic apparatus by using the combined structural properties of an enclosure, that houses the interwired heat producing electronic signal devices of the apparatus, to provide coolant movement and direction, locally selectable physical protection and shock resistance and electrical shielding.Type: GrantFiled: December 23, 1996Date of Patent: December 8, 1998Assignee: International Business Machines CorporationInventors: Raymond Robert Horton, Ismail Cevdet Noyan, Michael Jon Palmer, William Edward Pence, IV
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Patent number: 5768770Abstract: Process for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.Type: GrantFiled: June 7, 1995Date of Patent: June 23, 1998Inventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Ismail Cevdet Noyan, Michael Jon Palmer
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Patent number: 5734196Abstract: An electronic packaging interface between conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.Type: GrantFiled: October 13, 1995Date of Patent: March 31, 1998Assignee: International Business Machines CorporationInventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Ismail Gevdet Noyan, Michael Jon Palmer
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Patent number: 5687078Abstract: In a bonding station, a tooling principle is provided wherein first and second tool parts respectively hold first and second apparatus parts, each apparatus part having fine conductor periodicity edge bonding regions, in superpositioned registration with the tool parts providing space and accessability for optical alignment and for bonding heat and pressure. The tool members retain a first, position registered, apparatus part, with "X" - "Y" registration capability, in position with an edge bearing a fine conductor periodicity accessable by a tapered edge of the tool which permits optical fine alignment adjustment and bonding heat and pressure application.Type: GrantFiled: June 7, 1995Date of Patent: November 11, 1997Assignee: International Business Machines CorporationInventors: Raymond Robert Horton, Chandrasekhar Narayan, Michael Jon Palmer
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Patent number: 5675884Abstract: Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.Type: GrantFiled: June 7, 1995Date of Patent: October 14, 1997Assignee: International Business Machines CorporationInventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Ismail Cevdet Noyan, Michael Jon Palmer
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Patent number: 5669437Abstract: A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity.Type: GrantFiled: December 22, 1993Date of Patent: September 23, 1997Assignee: International Business Machines CorporationInventors: Bernardo Hernandez, Raymond Robert Horton, Ismail Cevdet Noyan, Michael Jon Palmer
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Patent number: 5641114Abstract: In a bonding station the parts of the apparatus to be bonded are retained at a thermal bias temperature at a permitted level and a thermal check valve interface is provided between the bonding location and the part of the station that would serve as a conduction heat sink, thereby thermally insulating other uninvolved parts of the structure and and confining the bonding heat to the bonding region. Such confinement reduces the dwell time that the bond must remain at the bonding temperature. The bonding station has a number of features: the parts to be bonded are maintained on a support member that is provided with a heat biasing capability that can establish the assembly at a specified temperature; a retention capability, such as the use of vacuum, is provided to maintain registration and thermal contact of the part with the support; and a thermal check valve capability is provided to control the rate of heat flow through the support member so that locallized heat is controlled in dissipation.Type: GrantFiled: June 7, 1995Date of Patent: June 24, 1997Assignee: International Business Machines CorporationInventors: Raymond Robert Horton, Chandrasekhar Narayan, Michael Jon Palmer