Abstract: An electro-optical transducer module comprises a substrate having a planar main surface, an electro-optical transducer adhered directly to the main surface of the substrate, and an optical fiber adhered directly to the main surface of the substrate. The optical fiber has an end face in optically coupled relationship with the transducer. A handling element is adhered to the fiber, the fiber being between the handling element and the main surface of the substrate.

Abstract: A temperature-compliant tube for fiber optic components is inserted into the exit port of an hermetically sealed package and extends into the interior of the package. An optical fiber extends through the temperature-compliant tube and is attached to a substrate interior of the package for coupling to an optical component mounted on the substrate. The optical fiber is hermetically sealed to the interior end of the temperature-compliant tube. The thermal coefficients of expansion and lengths for the temperature-compliant tube, the optical fiber between the substrate and the interior end of the tube, and the package body between the substrate and the exterior end of the exit port are tailored to provide zero differential expansion to enable the fiber optic components to be cycled over a wide temperature range without misalignment of the fiber relative to the optical component or mechanical failure of the fiber.

Abstract: A charge-coupled device package comprises a substrate of dielectric material and a charge-coupled device die mounted on one main face of the substrate. The substrate is placed in heat exchange relationship with a cold sink, such as a bath of LN.sub.2. A temperature sensor senses the temperature at a location on the main face that is in close proximity ot the die. A film resistor is adhered to the opposite main face of the substrate and receives a current that depends upon the temperature sensed by the sensor.

Abstract: An electro-optical transducer module comprises a base member having a generally flat surface and a platform upstanding from the flat surface, an electro-optical transducer mounted on the platform, a fiber mount plate secured to the base member with one main face in confronting relationship with the generally flat surface of the base member, and an optical fiber secured to the fiber mount plate by way of its other main face. The optical fiber has an end face that is in optically-coupled relationship with the electro-optical transducer.

Abstract: A pressure interconnect package for connecting an integrated circuit chip to an etched circuit board comprising a pressurized stack of circuit elements in which a flexible interconnecting circuit is disposed between the IC chip and the etched circuit board to cause them to make electrical contact upon the application of pressure to the stack.