Abstract: Applicators and dispensing systems for dispensing liquid hot melt adhesives and methods of dispensing liquid hot melt adhesives. The dispensing system supplies the liquid hot melt adhesive in a non-activated state to the applicator. The liquid hot melt adhesive is processed to modify at least one activation-sensitive property before dispensing onto a substrate. The property may exhibit a temperature dependence, in which case the applicator or other structure near the applicator heats the liquid hot melt adhesive immediately before application. The property may exhibit a pressure dependence, in which case the applicator or other structure near the application applies pressure and/or shear forces to the liquid hot melt adhesive shortly before dispensing. Alternatively, a property that is both temperature and pressure dependent may be modified.