Patents by Inventor Raymond Teh Wai Tiong

Raymond Teh Wai Tiong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5898574
    Abstract: An electrical device (400) includes a substrate (300) having solder pads (215, 220) formed thereon and a self aligning electrical component (200) mounted to the solder pads (215, 220). The self aligning electrical component (200) includes a body having a cylindrical shape, a first terminal (205) formed on an inner region of the body, and a second terminal (210) formed around outer regions of the body surrounding the first terminal (205).
    Type: Grant
    Filed: September 2, 1997
    Date of Patent: April 27, 1999
    Inventors: Wiling Tan, Raymond Teh Wai Tiong, Lian It Song