Patents by Inventor Rebecca Holdford

Rebecca Holdford has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pre-doped reflow interconnections for copper pads
    Publication number: 20050275096
    Abstract: A metal interconnect structure (100) comprising a bond pad (110) of copper; a body (103) of eutectic alloy in contact with the bond pad, this alloy including copper; and a contact pad (120) comprising copper in contact with the alloy body. When the eutectic alloy is tin/lead, the alloy includes copper in an amount greater than 0.08 weight percent and less than 2.0 weight percent. When the eutectic alloy is tin/silver, the alloy includes copper in an amount greater than 0.9 weight percent and less than 2.0 weight percent.
    Type: Application
    Filed: August 16, 2004
    Publication date: December 15, 2005
    Inventors: Kejun Zeng, Tz-Cheng Chiu, Rebecca Holdford