Abstract: Concepts and technologies are described herein for providing status of site access requests. In accordance with the concepts and technologies disclosed herein, a user attempts to access functionality of a server application that is limited to authorized users. In response to the access attempt, the server application determines if the user is authorized to access the functionality and if the user has previously requested access to the functionality. If the user has not previously requested access to the application, the server application can present a user interface to the user for requesting access to the server application. If the user has previously requested access to the application, the server application can present an indication that an access request already exists, history and status information associated with the access request, and/or an interface for submitting messages to the site owner or other entity.

Abstract: Concepts and technologies are described herein for providing status of site access requests. In accordance with the concepts and technologies disclosed herein, a user attempts to access functionality of a server application that is limited to authorized users. In response to the access attempt, the server application determines if the user is authorized to access the functionality and if the user has previously requested access to the functionality. If the user has not previously requested access to the application, the server application can present a user interface to the user for requesting access to the server application. If the user has previously requested access to the application, the server application can present an indication that an access request already exists, history and status information associated with the access request, and/or an interface for submitting messages to the site owner or other entity.

Abstract: Solder paste (16) is dispensed onto a platen (12) that includes depressions (14) that are preferably conical or in an inverted pyramid shape. The solder paste (16) is formed of a plurality of particles composed of a solder alloy. Excess solder paste (16) is removed, and a predetermined solder paste volume fills the depressions (14). A substrate (18) is superposed onto platen (12) such that solder-wettable bond pads (20) on the substrate (18) register with the depressions (14). The platen (12) is heated to melt the solder alloy, and the solder alloy coalesces to form molten solder droplets (22). The solder droplets (22) are transferred onto the solder-wettable bond pads (20) to form solder bumps (24) bonded to the bond pads (20).

Abstract: An integrated circuit chip carrier (100) provides an improved mounting pad density. The chip carrier (100) includes a flexible substrate (102) with pads (104) on the top surface for interconnection with an attached integrated circuit chip (302). The chip carrier (100) further includes a mounting pad array (502) on the bottom surface having an interconnection with the pads (104), and a rigid substrate (202) having an array of holes (204) extending through it. The top surface of the rigid substrate (202) is fixedly attached to the bottom surface of the flexible substrate (102). Individual holes of the array of holes (204) correspond to and align with individual pads of the mounting pad array (502). The chip carrier (100) further includes solder (206) disposed on the mounting pad array (502) and extending through the array of holes (204) beyond the bottom surface of the rigid substrate (202) for mounting the integrated circuit chip carrier (100) to a circuit bearing substrate (700).

Abstract: An electronic device (100) comprises a circuit carrying substrate (300) having an electronic circuit pattern (301) formed thereon, at least one component (302) having leads (304) for electrically coupling the at least one component (302) to the electronic circuit pattern (301) formed on the circuit carrying substrate (300), and a thermoplastic coating (200, 200') for covering the leads (304) of the at least one component (302) to insulate the leads (304) thereof.

Abstract: An integrated circuit (70) is soldered to a printed circuit board (200) by first depositing flux (116) on bumps (75) of the integrated circuit. Solder (214) is deposited upon the bumps (75), and the integrated circuits is (70) placed in contact with pads (210) on the printed circuit board (200). After reflow, a solder joint (230) electrically and mechanically attaches the integrated circuit (70) to the printed circuit board (200).Alternatively, the solder tipped (214) bumps (75) may be placed in contact with a non-adhering flat plane (300) such as glass during the heating process. After reflow, each bump has a flat portion (350), and the flat portions of all the bumps form a plane (400) which further facilitates attaching the integrated circuit (70) to the printed circuit board (200).

Abstract: A method and apparatus for underencapsulating a component (502) on a substrate (402). The method robotically places an underencapsulant film (406) on at least one surface of a first surface of the component (502) and a second surface of a substrate (402), the first and second surfaces substantially opposing each other when the component (502) is placed on the substrate (402). Next, the method places the component (502) on the substrate (402) to dispose the underencapsulant film (406) between the first and second surfaces. The method then bonds (1006,1008 or 1006,1010) the component (502) to the substrate (402) with the underencapsulant (406).