Patents by Inventor Reginald T. Taar

Reginald T. Taar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer cutting using laser marking
    Patent number: 6930276
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: August 16, 2005
    Assignee: Intel Corporation
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Jr., Reginald T. Taar
  • Wafer cutting using laser marking
    Patent number: 6911377
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: June 28, 2005
    Assignee: Intel Corporation
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Jr., Reginald T. Taar
  • Wafer cutting using laser marking
    Publication number: 20040159642
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 19, 2004
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Reginald T. Taar
  • Wafer cutting using laser marking
    Publication number: 20040161877
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 19, 2004
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Reginald T. Taar
  • Wafer cutting using laser marking
    Patent number: 6716723
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: April 6, 2004
    Assignee: Intel Corporation
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Jr., Reginald T. Taar
  • Semiconductor dice with edge cavities
    Publication number: 20040026768
    Abstract: A rounded wafer blade and stacked semiconductor package having a die with a cavity defined by a curved lower surface thereof. The curved lower surface and cavity allow for wire bonding directly therebelow at the top surface of another die of the semiconductor package. Additionally, wire bonding may proceed at a surface of the die opposite the curved lower surface without significant impact on a structural integrity of the die.
    Type: Application
    Filed: August 8, 2002
    Publication date: February 12, 2004
    Inventors: Reginald T. Taar, Anthony H. Dajac, Carlo C. Tiongson
  • Wafer cutting using laser marking
    Publication number: 20030228739
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Application
    Filed: June 5, 2002
    Publication date: December 11, 2003
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Reginald T. Taar