Patents by Inventor Reid Hayashi

Reid Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8337547
    Abstract: The present invention embodies an endovascular graft having an attachment frame connection mechanism that allows placement of the main body component in vasculature in combination with limb components. Various limb component-to-main body component attachment mechanisms are provided which ensure a reliable bond while facilitating a smaller delivery profile.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: December 25, 2012
    Assignee: Endovascular Technologies, Inc.
    Inventors: Octavian Iancea, Timothy A. M. Chuter, Arnold M. Escano, Reid Hayashi, Robin W. Eckert, Matthew J. Fitz, Shahrokh R. Farahani, Juan I. Perez, Richard Newhauser, David T. Pollock, Aleta Tesar
  • Publication number: 20100161028
    Abstract: The present invention embodies an endovascular graft having various frame-to-main body component attachment mechanisms which provide a secured bond, reduced graft material wear, and reduced delivery profile.
    Type: Application
    Filed: March 4, 2010
    Publication date: June 24, 2010
    Applicant: ENDOVASCULAR TECHNOLOGIES, INC.
    Inventors: Timothy A.M. Chuter, Matthew J. Fitz, Robin W. Eckert, Vivianne M. Holt, Tina Ton, Octavian Iancea, Juan I. Perez, Richard Newhauser, Shuji Uemura, David T. Pollock, Reid Hayashi, George Caffell
  • Patent number: 7708771
    Abstract: The present invention embodies an endovascular graft having various frame-to-main body component attachment mechanisms which provide a secure bond, reduced graft material wear, and reduced delivery profile.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: May 4, 2010
    Assignee: Endovascular Technologies, Inc.
    Inventors: Timothy A. M. Chuter, Matthew J. Fitz, Robin W. Eckert, Vivianne M. Holt, Tina Ton, Octavian Iancea, Juan I. Perez, Richard Newhauser, Shuji Uemura, David T. Pollock, Reid Hayashi, George Caffell
  • Publication number: 20070276462
    Abstract: The present invention embodies an endovascular graft having an attachment frame connection mechanism that allows placement of the main body component in vasculature in combination with limb components. Various limb component-to-main body component attachment mechanisms are provided which ensure a reliable bond while facilitating a smaller delivery profile.
    Type: Application
    Filed: May 17, 2007
    Publication date: November 29, 2007
    Applicant: ENDOVASCULAR TECHNOLOGIES, INC.
    Inventors: Octavian Iancea, Timothy Chuter, Arnold Escano, Reid Hayashi, Robin Eckert, Matthew Fitz, Shahrokh Farahani, Juan Perez, Richard Newhauser, David Pollock, Aleta Tesar
  • Patent number: 7226474
    Abstract: The present invention embodies an endovascular graft having an attachment frame connection mechanism that allows placement of the main body component in vasculature in combination with limb components. Various limb component-to-main body component attachment mechanisms are provided which ensure a reliable bond while facilitating a smaller delivery profile.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: June 5, 2007
    Assignee: Endovascular Technologies, Inc.
    Inventors: Octavian Iancea, Timothy A. M. Chuter, Arnold M. Escano, Reid Hayashi, Robin W. Eckert, Matthew J. Fitz, Shahrokh R. Farahani, Juan I. Perez, Richard Newhauser, David T. Pollock, Aleta Tesar
  • Publication number: 20060149347
    Abstract: An endovascular graft having one or more sensors attached to its internal and external surface, one or more power sources attached to its external surface and one or more transmitters attached to its external surface, the sensors capable of measuring pertinent parameters and each transmitter capable of transmitting signals containing pertinent parameters to one or more receiving devices located outside the patient's body. The sensors may measure pressure, temperature, blood flow, electrical potential, or any combination thereof. The sensors may be attached at specific locations on the graft material, thereby providing pertinent parameters from critical points inside the vasculature, or may be attached to form an array of sensors over the internal and external surface of the graft material, thereby providing a complete profile of pertinent parameters throughout the vasculature covered by the endovascular graft.
    Type: Application
    Filed: January 23, 2006
    Publication date: July 6, 2006
    Inventors: Reid Hayashi, Alfred Concemi
  • Patent number: 6658288
    Abstract: Disclosed are apparatus and methods for aiding thrombosis through the application of electric potential. In one embodiment, a hollow prosthesis is placed within a patient at a treatment site, such as at an aneurysm. The outer surface of a prosthesis is given a positive charge. The positive charge on the outer surface attracts negatively charged components of blood, thus facilitating the repair of perigraft flow. In another embodiment, a conductive wire is used to pierce a graft and enter an aneurysm sac. The wire is positively electrically charged to aid in thrombosis, thus facilitating the repair of perigraft flow.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: December 2, 2003
    Assignee: Endovascular Technologies, Inc.
    Inventor: Reid Hayashi
  • Publication number: 20030176912
    Abstract: The present invention embodies an endovascular graft having various frame-to-main body component attachment mechanisms which provide a secure bond, reduced graft material wear, and reduced delivery profile.
    Type: Application
    Filed: March 4, 2002
    Publication date: September 18, 2003
    Inventors: Timothy A.M. Chuter, Matthew J. Fitz, Robin W. Eckert, Vivianne M. Holt, Tina Ton, Octavian Iancea, Juan I. Perez, Richard Newhauser, Shuji Uemura, David T. Pollock, Reid Hayashi, George Caffell
  • Publication number: 20030176911
    Abstract: The present invention embodies an endovascular graft having an attachment frame connection mechanism that allows placement of the main body component in vasculature in combination with limb components. Various limb component-to-main body component attachment mechanisms are provided which ensure a reliable bond while facilitating a smaller delivery profile.
    Type: Application
    Filed: March 4, 2002
    Publication date: September 18, 2003
    Inventors: Octavian Iancea, Timothy A.M. Chuter, Arnold M. Escano, Reid Hayashi, Robin W. Eckert, Matthew J. Fitz, Shahrokh R. Farahani, Juan I. Perez, Richard Newhauser, David T. Pollock, Aleta Tesar
  • Publication number: 20020165593
    Abstract: Disclosed is an apparatus and method for aiding processes including thrombosis, hemostasis, embolization, anastomotic sealing, and void filling at a treatment site of a patient. The present invention provides for an apparatus and method for polymerizing a material and introducing it to the treatment site. A material is polymerized by various methods, including the application of a catalyst, the application of ultraviolet light, or the application of electromagnetic radiation.
    Type: Application
    Filed: May 3, 2001
    Publication date: November 7, 2002
    Inventors: Reid Hayashi, Mark T. Lemere
  • Publication number: 20020026217
    Abstract: The present invention is directed to an apparatus and method for sealing a graft in a vessel for preventing blood from flowing around the graft and for reducing the pressure within an aneurysm sac. The system generally includes an apparatus and method for safely and easily causing blood to thrombos between a graft and an aneurysm wall or other arteriovenous site.
    Type: Application
    Filed: December 6, 2000
    Publication date: February 28, 2002
    Inventors: Steven Baker, Peter Johansson, Reid Hayashi
  • Patent number: 6280464
    Abstract: A delivery catheter and gripping system for enabling manipulation of a prosthesis deployed or implanted at a repair site in a corporeal lumen, for repositioning of the prosthesis. The delivery catheter includes a grip at the proximal end, a jacket enlarged portion at the distal end, and a shaft therebetween, and has a channel extending therethrough, for enabling insertion, removal, expansion and compression of the gripping system. The gripping system is housed in the delivery catheter, and includes a grip and biasing spring at the proximal end, a plurality of resilient gripping elements at the distal end, and a deploying wire therebetween for enabling gripping, maneuvering, and repositioning of the prosthesis to the desired location.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: August 28, 2001
    Assignee: Endovascular Technologies, Inc.
    Inventor: Reid Hayashi
  • Patent number: 5910144
    Abstract: A delivery catheter and gripping system for enabling manipulation of a prosthesis deployed or implanted at a repair site in a corporeal lumen, for repositioning of the prosthesis. The delivery catheter includes a grip at the proximal end, a jacket enlarged portion at the distal end, and a shaft therebetween, and has a channel extending therethrough, for enabling insertion, removal, expansion and compression of the gripping system. The gripping system is housed in the delivery catheter, and includes a grip and biasing spring at the proximal end, a plurality of resilient gripping elements at the distal end, and a deploying wire therebetween for enabling gripping, maneuvering, and repositioning of the prosthesis to the desired location.
    Type: Grant
    Filed: January 9, 1998
    Date of Patent: June 8, 1999
    Assignee: Endovascular Technologies, Inc.
    Inventor: Reid Hayashi