Patents by Inventor Reiko NAKAJIMA

Reiko NAKAJIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11989011
    Abstract: A display system provided in production equipment having driving means and monitoring means with controllable features includes a control unit, a display unit, and a storage unit. The control unit obtains a feature output over time from at least one among the driving means and the monitoring means, and causes the storage unit to store the feature; constructs, in each prescribed time, a causal relationship model that indicates a causal factor selected from among the driving means and the monitoring means for at least one abnormality that can occur in the production equipment and that also indicates the relationship between causal factors on the basis of the obtained feature; and displays, on the display unit, a plurality of causal relationship models constructed in a plurality of times.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: May 21, 2024
    Assignee: OMRON Corporation
    Inventors: Toshifumi Minemoto, Reiko Hattori, Yuya Ota, Shinsuke Kawanoue, Akira Nakajima
  • Publication number: 20150290760
    Abstract: To provide a polishing composition which can polish a polishing object composed of a hard brittle material having the Vickers hardness of greater than 1,500 HV at a high polishing rate under a condition of a high polishing load (polishing pressure) of 150 g/cm2 or more and can suppress the generation of a defect such as scratches on the surface of the polishing object or the generation of scratches on a polishing pad, a holding jig or the like when polishing a polishing object composed of a hard brittle material using a polishing apparatus having the polishing pad. The polishing composition contains abrasive grains, water and an additive agent that is adsorbed on the surface of the polishing pad to decrease unnecessary frictional resistance between the polishing pad and the polishing object.
    Type: Application
    Filed: April 14, 2015
    Publication date: October 15, 2015
    Applicant: FUJIMI INCORPORATED
    Inventors: Masayuki SERIKAWA, Yasuhiro MOROE, Toshimi MIZUTANI, Reiko NAKAJIMA