Abstract: The present disclosure provides a cooling system, including an air-cooling device and a water-cooling device. The air-cooling device includes a first fan, an evaporator, a first condenser, and a second fan. The first fan is arranged in a first cooling room and configured to blow a hot air inside a rack into a first cooling room. The evaporator is arranged in the first cooling room. The first condenser is arranged in a second cooling room. The second fan is arranged in the second cooling room and configured to blow an outside air into the second cooling room. The water-cooling device includes a radiator. The radiator is arranged in the second cooling room and configured to receive a hot liquid from an electronic device in the rack through a third pipeline and transmit a cold liquid to the electronic device through a fourth pipeline.

Abstract: An immersion cooling system is provided. It includes a pressure seal tank, an electronic module, a blower, and a distributor plate. The pressure seal tank contains a cooling liquid, and a gas outlet is disposed on the top or a sidewall of the pressure seal tank, a gas inlet is disposed on the bottom of the pressure seal tank. The gas outlet is higher than the liquid level of the cooling liquid. The electronic module is disposed in the pressure seal tank and immersed in the cooling liquid. The blower is communicated with the pressure seal tank and configured to extract the gas from the gas outlet and inject the gas into the pressure seal tank via the gas inlet. The distributor plate is disposed in the pressure seal tank and located between the electronic module and the gas inlet.

Abstract: A working fluid recovery device includes an air moving unit, a water removal unit, a working fluid recovery unit, a condenser, and a working fluid collection tank. The air moving unit is configured to suck in a mixed gas including a non-condensable gas, a steam and a vapor phase of working fluid. The water removal unit is connected to the air moving unit, and configured to remove the steam. The working fluid recovery unit is connected to the water removal unit, and configured to recover the vapor phase of the working fluid and exhaust the non-condensable gas. The condenser is connected to the working fluid recovery unit, and configured to condense the vapor phase of the working fluid into a liquid phase of the working fluid. The working fluid collection tank is connected to the condenser, and configured to store the liquid phase of the working fluid.

Abstract: An immersion cooling system includes a pressure seal tank, an electronic apparatus, a pressure balance pipe and a relief valve. The pressure seal tank is configured to store coolant. A vapor space is formed in the pressure seal tank above the liquid level of the coolant. The electronic apparatus is completely immersed in the coolant. The pressure balance pipe has a gas collection length. The first port of the pressure balance pipe is disposed on the top surface of the pressure seal tank. The relief valve is disposed on the second port of the pressure balance pipe. The second port is farther away from the top surface of the pressure seal tank than the first port. The gas collection length of the pressure equalization tube allows the concentration of vaporized coolant at the first port to be greater than the concentration of vaporized coolant at the second port.

Abstract: The present disclosure provides an immersion cooling system for a server cabinet including a plurality of server boxes, a cooling tank and a plurality of liquid connecting pipes. Each server box includes an electronic device immersed in the cooling liquid, and the electronic device generates a thermal energy so that part of the cooling liquid evaporates into a hot vapor. The cooling tank is connected to the plurality of server boxes and includes a condenser and a storage part. The condenser is connected to each server box and condenses the hot vapor to form the cooling liquid. The storage part storages the cooling liquid from the condenser. Two ends of the liquid connecting pipe is connected to the storage part and the server box respectively. The cooling liquid in the storage part and the cooling liquid of each server box are maintained in a same liquid level.

Abstract: An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.

Abstract: An immersion cooling system includes a cooling tank, a housing and a valve. The coolant tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The housing covers a side of the cooling tank and thereby forms an enclosure. The valve has two ports, one of which communicates with the enclosure and the other communicates with a part of the cooling tank above the liquid coolant. The valve is configured to open in response to a gas pressure inside the cooling tank exceeding an upper limit.

Abstract: An immersion cooling system includes a cooling tank and a filtration system. The cooling tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The filtration system includes a pipeline, a pump, a filter and a cooling device. The pipeline is in fluid communication with the cooling tank. The pump is disposed in the pipeline and is configured to drive the liquid coolant to flow through the pipeline. The filter is disposed in the pipeline and is configured to filter the liquid coolant. The cooling device is connected to the pipeline and is configured to cool the liquid coolant. The pipeline has an inlet connected to the cooling tank. The cooling device is located between the pump and the inlet of the pipeline.

Abstract: An immersion cooling system includes a tank, an isolation plate and a condenser. The tank includes a base plate and a sidewall connected with the base plate. The sidewall defines with the base plate a space configured to accommodate a cooling liquid. The isolation plate connects with the sidewall or the base plate and divides the space into a first subsidiary space and a second subsidiary space. The first subsidiary space is configured to accommodate electronic equipment which is immersed in the cooling liquid. The isolation plate and the base plate are separated from each other. The sidewall surrounds the condenser. A vertical projection of the condenser towards the base plate at least partially overlaps with the second subsidiary space. The electronic equipment evaporates a portion of the cooling liquid to form a vapor. The condenser is configured to condense the vapor into a liquid form.

Abstract: A cabinet with filter life prediction function and a method of predicting filter life are provided. The cabinet has an airflow module generating airflow flowing through a filter module. An air quality sensor continuously monitors the air quality sensing value of the airflow and records the sensed value in association with the sensing time. A regression analysis is performed based on the record data to obtain a regression model when a modeling condition is met. When a prediction condition is met, a time period for the currently sensed value to decrease to a threshold is calculated to be a predicted remaining life of the filter module. A notification is generated when the predicted remaining life of the filter module is less than a life threshold.

Abstract: A heat sink includes a substrate, at least a first fin set and at least a second fin set. The first fin set is disposed on the substrate and has a plurality of first fins, and the first fin has a plurality of first holes. The second fin set is disposed on the substrate and has a plurality of second fins, and the second fin has a plurality of second holes. The total area of the second holes is larger than that of the first holes. An electronic device and a heat exchanger which are configured with the heat sink are also disclosed. The structure and configuration of the heat fins can increase the wind guiding effect, and thus improve the heat-dissipation efficiency.

Abstract: A cooling device applied in a projection apparatus and the projection apparatus are provided. The projection apparatus comprises a first light source, a second light source, a third light source and the cooling device. The cooling device comprises an airflow guiding device and a fan. The airflow guiding device is adapted to define a first flow path and a second flow path. The first flow path has a first position, while the second flow path has a second position and a third position, correspondingly disposed with the first light source, the second light source and the third light source, respectively. The fan is adapted to generate airflow. The airflow is divided into a first airflow and a second airflow entering the first flow path and the second flow path, respectively. Thereby, the cooling device is capable of matching the heat dissipation requirements of the light sources and reducing the noise generated by the cooling device by using only one fan.

Abstract: A wind speed detecting circuit includes a heating unit, a first temperature sensor, a second temperature sensor, a control unit and a driving unit. The first temperature sensor detects a first temperature of an internal portion of an electronic device, thereby generating a first detecting signal. The second temperature sensor detects a second temperature of the heating unit, thereby generating a second detecting signal. The control unit generates a modulation signal according to the first detecting signal and the second detecting signal. In response to the modulation signal, the driving unit generates a driving signal to control operations of the heating unit, so that a temperature difference between the first temperature and the second temperature is maintained constant. A specified relation between the wind speed and the modulation signal facilitates discriminating whether a dust-proof element of the electronic device needs to be replaced.

Abstract: A cooling device applied in a projection apparatus and the projection apparatus are provided. The projection apparatus comprises a first light source, a second light source, a third light source and the cooling device. The cooling device comprises an airflow guiding device and a fan. The airflow guiding device is adapted to define a first flow path and a second flow path. The first flow path has a first position, while the second flow path has a second position and a third position, correspondingly disposed with the first light source, the second light source and the third light source, respectively. The fan is adapted to generate airflow. The airflow is divided into a first airflow and a second airflow entering the first flow path and the second flow path, respectively. Thereby, the cooling device is capable of matching the heat dissipation requirements of the light sources and reducing the noise generated by the cooling device by using only one fan.

Abstract: A wind speed detecting circuit includes a heating unit, a first temperature sensor, a second temperature sensor, a control unit and a driving unit. The first temperature sensor detects a first temperature of an internal portion of an electronic device, thereby generating a first detecting signal. The second temperature sensor detects a second temperature of the heating unit, thereby generating a second detecting signal. The control unit generates a modulation signal according to the first detecting signal and the second detecting signal. In response to the modulation signal, the driving unit generates a driving signal to control operations of the heating unit, so that a temperature difference between the first temperature and the second temperature is maintained constant. A specified relation between the wind speed and the modulation signal facilitates discriminating whether a dust-proof element of the electronic device needs to be replaced.

Abstract: An electronic device having a heat-dissipating structure for a socket is disclosed. The electronic device comprises a case, a plurality of electronic components disposed in the case, an airflow inlet disposed at a first side of the case, a socket disposed at a second side of the case, wherein the second side is opposite to the first side and the electronic components are disposed between the first side and the second side, and an airflow directing plate disposed between the case and the electronic components and forming an airflow channel with the case for directing a portion of air at the airflow inlet to the socket through the airflow channel so as to dissipate heat of the socket. Through the design of the present invention, the heat of the socket of the electronic device can be dissipated efficiently to conform to the safety standard of the socket temperature.

Abstract: The heat-dissipating module of the electronic device comprises a fan, a first heat-dissipating component and a second heat-dissipating component. The fan is disposed on a first side of the casing, and the first heat-dissipating component is disposed on a second side of the casing and in heat contact with the electronic components for transferring heat generated by the electronic components to the casing. The second heat-dissipating component is disposed on an outer sidewall of the casing corresponding to the first heat-dissipating component and in heat contact with a system cooling system. Thereby, the heat generated by the electronic components is transferred to the second heat-dissipating component through the first heat-dissipating component and the casing, and then dissipated by the system cooling device.

Abstract: An electronic device having a heat-dissipating structure for a socket is disclosed. The electronic device comprises a case, a plurality of electronic components disposed in the case, an airflow inlet disposed at a first side of the case, a socket disposed at a second side of the case, wherein the second side is opposite to the first side and the electronic components are disposed between the first side and the second side, and an airflow directing plate disposed between the case and the electronic components and forming an airflow channel with the case for directing a portion of air at the airflow inlet to the socket through the airflow channel so as to dissipate heat of the socket. Through the design of the present invention, the heat of the socket of the electronic device can be dissipated efficiently to conform to the safety standard of the socket temperature.