Abstract: A system controller includes a light source, an optical guiding assembly, a sensor and a feedback controller, and is applied to perform a solder operation with a solder module. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The system controller is a static part, and the solder module is a dynamic part.

Abstract: A laser processing device for processing a workpiece is provided, including a laser emitter, a lens module, a driving module, a camera module, and a processing unit. The lens module has a first lens and a second lens, wherein the laser emitter emits a laser beam through the first and second lenses to the workpiece. The driving module drives the first lens to move relative to the second lens. The camera module captures an image of the workpiece. The processing unit is electrically connected to the camera module and the driving module, wherein the camera module transmits an image signal to the processing unit according to the image of the workpiece, and the processing unit transmits a driving signal to the driving module according to the image signal, driving the first lens to move relative to the second lens. A method for processing a workpiece is also provided.

Abstract: A system controller includes a light source, an optical guiding assembly, a sensor and a feedback controller, and is applied to perform a solder operation with a solder module. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The system controller is a static part, and the solder module is a dynamic part.

Abstract: A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.

Abstract: A soldering process method includes steps of: establishing a material component database; establishing a working parameter database; analyzing material and component characteristics required for a new soldering process; comparing the characteristics with information in the material component database; selecting operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; performing the soldering process using the operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; measuring and recording the soldering process execution information and the final product information; determining whether the final product of the solder process meets the quality control requirements; using the machine learning method to fit the soldering process execution information and the final product information of the solder process to get the operating parameters for the next sol

Abstract: A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature.

Abstract: A laser processing device for processing a workpiece is provided, including a laser emitter, a lens module, a driving module, a camera module, and a processing unit. The lens module has a first lens and a second lens, wherein the laser emitter emits a laser beam through the first and second lenses to the workpiece. The driving module drives the first lens to move relative to the second lens. The camera module captures an image of the workpiece. The processing unit is electrically connected to the camera module and the driving module, wherein the camera module transmits an image signal to the processing unit according to the image of the workpiece, and the processing unit transmits a driving signal to the driving module according to the image signal, driving the first lens to move relative to the second lens. A method for processing a workpiece is also provided.

Abstract: A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature.

Abstract: A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.

Abstract: A soldering process method includes steps of: establishing a material component database; establishing a working parameter database; analyzing material and component characteristics required for a new soldering process; comparing the characteristics with information in the material component database; selecting operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; performing the soldering process using the operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; measuring and recording the soldering process execution information and the final product information; determining whether the final product of the solder process meets the quality control requirements; using the machine learning method to fit the soldering process execution information and the final product information of the solder process to get the operating parameters for the next sol

Abstract: A multi-beam soldering system includes a multi-beam scanner, a sensor, and a controller. The multi-beam scanner generates at least a first beam and a second beam, and guides the first beam to a first element of a soldering zone and guides the second beam to a second element of the soldering zone. The sensor detects a first temperature of the first element and a second temperature of the second element simultaneously during soldering process. The controller adjusts the parameters of the first beam and the second beam under the condition that the first temperature is substantially different from the second temperature.