Patents by Inventor Renjish Narayan

Renjish Narayan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9301041
    Abstract: A headphone comprises a speaker. The rear volume of the speaker is coupled to a mixing volume, the front volume of the speaker is coupled to the mixing volume, and the mixing volume is coupled to the exterior. The acoustic impedances resulting from the rear volume, the front volume, the mixing volume, and the passages between them can be adjusted, in order to achieve the desired sound egress properties. Acoustic damping material can be included in the various leakage paths in order to achieve the desired properties, depending on the type of speaker to be used, the acoustic design of the headphone, the mechanical properties of the headphone body, and the desired frequency response characteristics of the headphone.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: March 29, 2016
    Assignee: Cirrus Logic International Semiconductor Ltd.
    Inventor: Renjish Narayan
  • Publication number: 20140169584
    Abstract: A headphone comprises a speaker. The rear volume of the speaker is coupled to a mixing volume, the front volume of the speaker is coupled to the mixing volume, and the mixing volume is coupled to the exterior. The acoustic impedances resulting from the rear volume, the front volume, the mixing volume, and the passages between them can be adjusted, in order to achieve the desired sound egress properties. Acoustic damping material can be included in the various leakage paths in order to achieve the desired properties, depending on the type of speaker to be used, the acoustic design of the headphone, the mechanical properties of the headphone body, and the desired frequency response characteristics of the headphone.
    Type: Application
    Filed: July 6, 2012
    Publication date: June 19, 2014
    Applicant: Wolfson Microelectronics plc
    Inventor: Renjish Narayan