Abstract: Disclosed herein are a production apparatus of a motor laminated core and a method for producing the same, the production apparatus comprises an upper die assembly, a lower die assembly and an adhesive spraying device, the adhesive spraying device comprises an adhesive spraying plate, a first die plate and a second die plate successively from top to bottom, and channels are disposed between the plates, and respective channels communicate with first adhesive spraying openings and second adhesive spraying openings so as to coat an adhesive on a portion of a metal strip used for forming an core sheet, and after the core sheet is formed, a plurality of core sheets are cured and bonded at normal temperature in the production apparatus with the aid of a hydraulic cylinder so as to form a motor laminated core.

Abstract: Disclosed herein are a production apparatus of a motor laminated core and a method for producing the same, the production apparatus comprises an upper die assembly, a lower die assembly and an adhesive spraying device, the adhesive spraying device comprises an adhesive spraying plate, a first die plate and a second die plate successively from top to bottom, and channels are disposed between the plates, and respective channels communicate with first adhesive spraying openings and second adhesive spraying openings so as to coat an adhesive on a portion of a metal strip used for forming an core sheet, and after the core sheet is formed, a plurality of core sheets are cured and bonded at normal temperature in the production apparatus with the aid of a hydraulic cylinder so as to form a motor laminated core.

Abstract: The present disclosure relates to a plane-distributed load sharing pressure device and a use method thereof. The plane-distributed load sharing pressure device includes a first-stage balance rod to an Nth-stage balance rod, N?2. The middle part of the first-stage balance rod is hinged to a force applying member. The two ends of the first-stage balance rod are respectively perpendicular to and hinged to the middle parts of second-stage balance rods. The two ends of the second-stage balance rod are respectively perpendicular to and hinged to the middle parts of third-stage balance rods. Similarly, the two ends of an (N?1)th-stage balance rod are respectively perpendicular to and hinged to the middle parts of Nth-stage balance rods. Force bearing members used for resolving a force applied by the force applying member to target members are arranged at the two ends of the Nth-stage balance rods.

Abstract: The present disclosure relates to a plane-distributed load sharing pressure device and a use method thereof. The plane-distributed load sharing pressure device includes a first-stage balance rod to an Nth-stage balance rod, N?2. The middle part of the first-stage balance rod is hinged to a force applying member. The two ends of the first-stage balance rod are respectively perpendicular to and hinged to the middle parts of second-stage balance rods. The two ends of the second-stage balance rod are respectively perpendicular to and hinged to the middle parts of third-stage balance rods. Similarly, the two ends of an (N?1)th-stage balance rod are respectively perpendicular to and hinged to the middle parts of Nth-stage balance rods. Force bearing members used for resolving a force applied by the force applying member to target members are arranged at the two ends of the Nth-stage balance rods.

Abstract: In an embodiment, a semiconductor apparatus comprises: a semiconductor chip, a substrate, and a bonding layer located between the semiconductor chip and the substrate that bonds the semiconductor chip and the substrate, wherein the bonding layer comprises sintered metal that comprises a plurality of voids, and wherein at least a portion of the plurality of voids are filled with a specific material having fluidity at a temperature higher than a preset temperature and is curable after being heated and melted.

Abstract: An apparatus and method for aligning an optical fiber with an optical device having bond pads attached thereto. The apparatus includes a fiber mount assembly having a body portion with an opening provided therein to receive the optical fiber, and two leg portions integrally connecting to and extending from the body portion. Bond pads are also attached to the two leg portions. The apparatus further includes an optical device mount assembly having bond pads attached thereto, and a plurality of eutectic solder bumps provided on the bond pads. The eutectic solder bumps connect the bond pads of the optical device and the two leg portions of the fiber mount assembly to the bond pads of the optical device mount assembly.

Abstract: In accordance with the invention, a multimode optical fiber communication system is provided with offset illumination by disposing an optical pinhole adjacent an end of the multimode fiber core and offset from the center of the core. The pinhole permits direct offset illumination without the difficulty and expense of a conventional patch-cord assembly.

Abstract: In accordance with the invention, an optical fiber system comprising a laser source an optical fiber including a reflective input end for receiving light from the source is provided with a polarization quarter-wave plate between the laser and the reflective end for minimizing power fluctuations from back reflection. The quarter-wave plate does not prevent back reflection but rather rotates the polarization of the back reflected light so that it does not interfere with the polarized light within the cavity. In an advantageous embodiment the quarter-wave plate is disposed within a receptacle laser package.

Abstract: The invention is an optoelectronic device including an optical subassembly enclosed within a plastic housing. The housing includes a wall with an aperture and a lens mounted therein. A plastic receptacle is mounted to the wall. The receptacle includes an opening which is aligned with the lens and which is capable of receiving an optical fiber so that the fiber is aligned with light emitted from the optical assembly. The receptacle is preferably mounted to the wall by means of epoxy.

Abstract: A fixture for use in the bonding of a plurality of chips each to a respective one of a plurality of substrates includes a lower vacuum chuck and a frame member supported on the chuck for reciprocatory motion toward and away from the chuck surface. The chuck surface is arranged to hold substrates with predeposited solder in pockets at predetermined locations thereon. The frame member has openings aligned with those pockets and weights which extend through the openings. After substrates are placed on the chuck surface, the substrates are heated so that the predeposited solder reaches eutectic status, and then chips are placed on the substrates. The frame member is then mounted on the chuck and gradually lowered until the weights press against respective chips, thereby holding the chips in position on the substrates. The entire assembly is then transported to a solder reflow bonding station.

Abstract: A fixture for use in the bonding of a plurality of chips each to a respective one of a plurality of substrates includes a lower vacuum chuck and a frame member supported on the chuck for reciprocatory motion toward and away from the chuck surface. The chuck surface is arranged to hold substrates with predeposited solder in pockets at predetermined locations thereon. The frame member has openings aligned with those pockets and weights which extend through the openings. After substrates are placed on the chuck surface, the substrates are heated so that the predeposited solder reaches eutectic status, and then chips are placed on the substrates. The frame member is then mounted on the chuck and gradually lowered until the weights press against respective chips, thereby holding the chips in position on the substrates. The entire assembly is then transported to a solder reflow bonding station.