Patents by Inventor Reynaldo S. Atienza

Reynaldo S. Atienza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer cutting using laser marking
    Patent number: 6930276
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: August 16, 2005
    Assignee: Intel Corporation
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Jr., Reginald T. Taar
  • Wafer cutting using laser marking
    Patent number: 6911377
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: June 28, 2005
    Assignee: Intel Corporation
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Jr., Reginald T. Taar
  • Wafer cutting using laser marking
    Publication number: 20040159642
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 19, 2004
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Reginald T. Taar
  • Wafer cutting using laser marking
    Publication number: 20040161877
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 19, 2004
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Reginald T. Taar
  • Wafer cutting using laser marking
    Patent number: 6716723
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: April 6, 2004
    Assignee: Intel Corporation
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Jr., Reginald T. Taar
  • Wafer cutting using laser marking
    Publication number: 20030228739
    Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
    Type: Application
    Filed: June 5, 2002
    Publication date: December 11, 2003
    Inventors: Lamberto V. Nepomuceno, Reynaldo S. Atienza, Reginald T. Taar
  • Apparatus, system and method to reduce wafer warpage
    Publication number: 20030209310
    Abstract: Typically, the frontside of a wafer is protected by a tape during backgrinding. Electrostatic charge may accumulate on the tape during the backgrinding operation. The wafer may warp after the backgrinding operation because the thinned wafer is not sufficiently rigid to counteract the bending forces resulting from the accumulation of electrostatic charge. In order to reduce wafer warpage, ionized air may be directed onto the wafer and tape to reduce the accumulation of electrostatic charge.
    Type: Application
    Filed: May 13, 2002
    Publication date: November 13, 2003
    Inventors: Anastacio C. Fuentes, Reynaldo S. Atienza, Chesalon M. Clavio