Abstract: A PV array (10) comprising multiple PV modules (11, 12) that each have a first and second pairs of spaced apart terminals (28, 40), with the first pair of spaced apart terminals (28) being in electrical connection with the PV cells of the PV modules (11, 12). A by-pass conductor (30) connects the second pair of spaced apart terminals (40) and enables current to pass through the PV modules (11, 12) between the second pair of spaced apart terminals (40). The second pair of terminals (40) of a first PV module (11) are each connected electrically to a terminal (28) of the first pair of terminals (28) of two adjacent PV modules to which the first PV module is connected. The by-pass conductor (30) of the first PV module facilitates travel of electrical current from the first PV module to a second PV module, by connection of the first terminals (28) of the first PV module (11) to the second terminals (40) of the second PV module (12).

Abstract: As a step in performing a process on a structure, a hole pattern is provided in a thin layer of organic resin masking material formed over the structure to provide a process mask. A processing step is then performed through the openings in the mask, and after a processing step is completed the mask is adjusted by a re-flow process in which the structure is placed into an atmosphere of solvent vapor of a solvent of the mask material. By way of the re-flow process, the mask material softens and re-flows to reduce the size of the openings in the mask causing edges of the surface areas on which the processing step was performed to be covered by the mask for subsequent processing steps.

Abstract: As a step in performing a process on a structure, a hole pattern is provided in a thin layer of organic resin masking material formed over the structure to provide a process mask. A processing step is then performed through the openings in the mask, and after a processing step is completed the mask is adjusted by a re-flow process in which the structure is placed into an atmosphere of solvent vapor of a solvent of the mask material. By way of the re-flow process, the mask material softens and re-flows to reduce the size of the openings in the mask causing edges of the surface areas on which the processing step was performed to be covered by the mask for subsequent processing steps.

Abstract: As a step in performing a process on a structure, a hole pattern is provided in a thin layer of organic resin masking material formed over the structure to provide a process mask. A processing step is then performed through the openings in the mask, and after a processing step is completed the mask is adjusted by a re-flow process in which the structure is placed into an atmosphere of solvent vapor of a solvent of the mask material. By way of the reflow process, the mask material softens and re-flows to reduce the size of the openings in the mask causing edges of the surface areas on which the processing step was performed to be covered by the mask for subsequent processing steps.

Abstract: A method of texturing a substrate or superstrate support material is provided, in which a thin textured film (32) is applied to the surface of the support material such as glass sheet (11). The dipping process is performed by loading a sheet (50) of the support material (11) into a frame (51) which provides a small number of small area contact points (52, 53) at which the sheet (50) is supported and lowering the frame (51) into texturing solution (59) comprising a mixture (59) of Sol-Gel (61) and texturing particles (62) comprising SiO2 monospheres. The sheet is then withdrawn from the texturing solution and the resultant film allowed to dry. The film is then sintered and the resulting film provides a textured surface suitable for the formation of a photovoltaic device.

Abstract: As a step in performing a process on a structure, a hole pattern is provided in a thin layer of organic resin masking material formed over the structure to provide a process mask. A processing step is then performed through the openings in the mask, and after a processing step is completed the mask is adjusted by a re-flow process in which the structure is placed into an atmosphere of solvent vapor of a solvent of the mask material. By way of the reflow process, the mask material softens and re-flows to reduce the size of the openings in the mask causing edges of the surface areas on which the processing step was performed to be covered by the mask for subsequent processing steps.

Abstract: A method of texturing a substrate or superstrate support material is provided, in which a thin textured film (32) is applied to the surface of the support material such as glass sheet (11). The dipping process is performed by loading a sheet (50) of the support material (11) into a frame (51) which provides a small number of small area contact points (52, 53) at which the sheet (50) is supported and lowering the frame (51) into texturing solution (59) comprising a mixture (59) of Sol-Gel (61) and texturing particles (62) comprising SiO2 monospheres. The sheet is then withdrawn from the texturing solution and the resultant film allowed to dry. The film is then sintered and the resulting film provides a textured surface suitable for the formation of a photovoltaic device.