Abstract: The preferred device (e.g. printed circuit board or PCB) includes a XLAUI bi-directional lane link (i.e. ¼ XLAUI channel) inserted onto the printed circuit board between a PHY integrated circuit and an Ethernet media access control (MAC) processor. This XLAUI bi-directional lane link replaces the electrical XFI channel in 10 Gb/s interconnects between integrated circuits on a PCB. The preferred methodology includes inserting a bi-directional 10 Gb/s XLAUI lane link onto a printed circuit board for use in 10 Gb/s interconnects between a PHY integrated circuit and a MAC processor.

Abstract: Access to the XAUI lanes of a 10 Gigabit Ethernet device is provided when needed for testing of the XAUI electrical interface. Access is provided by extending the XAUI interface contained in a XENPAK interface connector. An embodiment of the present invention uses an extension of the XENPAK connector to generate and receive XAUI signals thus making it possible for any device with a XENPAK connector to become a XUAI tester with minimal components between the test equipment and the device under test. The reduction of components (only an AC-Coupling capacitor resides between the XENPAK connector and the SMA connector) results in significant reduction in insertion loss and signal degradation. Also, the availability of any device with a XENPAK interface as a XAUI tester eliminates any requirement for specialized test equipments. The XAUI Extender card fits in the slot in the test equipment that would normally house the XENPAK module.

Abstract: Access to the XAUI lanes of a 10 Gigabit Ethernet device is provided when needed for testing of the XAUI electrical interface. Access is provided by extending the XAUI interface contained in a XENPAK interface connector. An embodiment of the present invention uses an extension of the XENPAK connector to generate and receive XAUI signals thus making it possible for any device with a XENPAK connector to become a XUAI tester with minimal components between the test equipment and the device under test. The reduction of components (only an AC-Coupling capacitor resides between the XENPAK connector and the SMA connector) results in significant reduction in insertion loss and signal degradation. Also, the availability of any device with a XENPAK interface as a XAUI tester eliminates any requirement for specialized test equipments. The XAUI Extender card fits in the slot in the test equipment that would normally house the XENPAK module.