Abstract: Techniques and systems for electronic circuit board design is provided herein. An example apparatus comprises an input structure that couples an input voltage node on a circuit board to input nodes of more than one voltage regulator circuit, wherein at least controller footprints differ among each of the more than one voltage regulator circuit. The apparatus further comprises a shared structure that couples switch nodes of the more than one voltage regulator circuit to a first terminal of an inductor footprint common to the more than one voltage regulator circuit, and an output structure that couples a second terminal of the inductor footprint to an output voltage node.

Abstract: Power control and decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, wherein the first circuit board is coupled to first surface of a system circuit board. The assembly also includes a second circuit assembly comprising a second circuit board having one or more voltage adjustment units configured to supply at least one input voltage to the integrated circuit device, wherein the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

Abstract: Power control arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes an integrated circuit device comprising one or more processing cores and a power domain configured to distribute a supply voltage to the one or more processing cores. The assembly also includes a charge injection circuit coupled to the power domain of the integrated circuit device, and configured to selectively couple electric charge into the power domain to predictively offset at least portions of voltage transients in the power domain.

Abstract: Power supply circuitry and enhanced associated techniques are presented herein. In one example, a method includes powering a circuit with a plurality of power supply phases, and monitoring thermal properties of the plurality of power supply phases. Responsive to the thermal properties indicating at least one of the plurality of power supply phases exceeds a thermal threshold, the method includes selecting a dormant power supply phase to supplant the at least one of the plurality of power supply phases.

Abstract: Voltage control arrangements for integrated circuit devices are discussed herein. In one example, a method includes receiving an indication of one or more software elements selected for execution by an integrated circuit device, and determining a target level of a supply voltage for the integrated circuit device based on the indication. The method also includes controlling voltage regulation circuitry to adjust a present level of the supply voltage for the integrated circuit device in accordance with the target level.

Abstract: Decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, where the first circuit board is coupled to first surface of a system circuit board. The assembly includes a second circuit assembly comprising a second circuit board having decoupling capacitance for the integrated circuit device, where the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

Abstract: Power control and decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, wherein the first circuit board is coupled to first surface of a system circuit board. The assembly also includes a second circuit assembly comprising a second circuit board having one or more voltage adjustment units configured to supply at least one input voltage to the integrated circuit device, wherein the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

Abstract: Power control arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes an integrated circuit device comprising one or more processing cores and a power domain configured to distribute a supply voltage to the one or more processing cores. The assembly also includes a charge injection circuit coupled to the power domain of the integrated circuit device, and configured to selectively couple electric charge into the power domain to predictively offset at least portions of voltage transients in the power domain.

Abstract: Integrated circuit device carriers and packaging assemblies which have attached decoupling capacitance are discussed herein. In one example, an assembly includes a package assembly comprising a carrier circuit board and an integrated circuit device coupled to a first side of the carrier circuit board. The assembly includes decoupling capacitors for the integrated circuit device are coupled to a second side of the carrier circuit board opposite from at least a portion of a footprint of the integrated circuit device on the carrier circuit board. A motherboard can be coupled to the package assembly and have at least one motherboard substrate layer facing the decoupling capacitors.

Abstract: Integrated circuit device carriers and packaging assemblies which have attached decoupling capacitance are discussed herein. In one example, an assembly includes a package assembly coupled to a motherboard and comprising a carrier circuit board and an integrated circuit device coupled to a first side of the carrier circuit board. The assembly also includes decoupling capacitors for the integrated circuit device conductively coupled between the motherboard and a second side of the carrier circuit board opposite from at least a portion of a footprint of the integrated circuit device on the carrier circuit board.

Abstract: Power supply circuitry and enhanced associated techniques are presented herein. In one example, a method includes powering a circuit with a plurality of power supply phases, and monitoring thermal properties of the plurality of power supply phases. Responsive to the thermal properties indicating at least one of the plurality of power supply phases exceeds a thermal threshold, the method includes selecting a dormant power supply phase to supplant the at least one of the plurality of power supply phases.