Abstract: A Balun assembly has a signal conductor (2) on the balanced side of a Balun, the signal conductor (2) being joined to a microstrip RF launch area 7 on a circuit board 6, the signal conductor (2) having a bend of axial orientation for lower cost, reliability, avoiding contact with a ground circuit path (9), being more suited for higher volume manufacturing, that distributes thermal expansion and contraction thereof substantially throughout to lessen stress at a junction of the signal conductor (2) and the RF launch area (7), and the signal conductor (2) being of minimum length and of smooth and even curvature to lessen impedance mismatch at the junction.