Abstract: A computer system includes a processor core and a memory system in signal communication with the processor core. The memory system includes a first cache and a second cache. The first cache is arranged at a first level of a hierarchy in the memory system and is configured to store a plurality of first-cache entries. The second cache is arranged at a second level of the hierarchy that is lower than the first level, and stores a plurality of second-cache entries. The first cache maintains a directory that contains information for each of the first-cache entries. The second cache maintains a shadow pointer directory (SPD) that includes one or more SPD entries that maps each of the first-cache entries to a corresponding second cache entry at a lower-level cache location.

Abstract: A lower-level cache managing cross-core invalidation (XI) snapshots in a shared-memory multiprocessing system, wherein the management of XI snapshots reduces an amount of required snapshots while allowing shared lower-level caches, comprising: the lower-level cache maintaining respective response sync state for at least one processor in a plurality of processors signifying that a line may have been changed by another processor since last fetched by a requesting processor.

Abstract: Wafer demount apparatus automatically demounts and transports a polished semiconductor wafer to an inspection station. The apparatus includes a bridge located between a polishing block supporting wax-mounted wafers and an offload conveyor. The bridge fills the gap and provides a smooth transition surface for the wafers moving from the polishing block to the conveyor. The bridge is also capable of movement to achieve vertical and horizontal alignment with the polishing block.

Abstract: A method for mounting a semiconductor wafer on a polishing block to hold the semiconductor wafer during polishing. The method comprises the steps of providing a polishing block having a surface for mounting the semiconductor wafer and providing a heater comprising a heater body and a thermally conductive buffer plate which is selectively moveable with respect to the heater body between a pre-heating position in which the plate is spaced from the heater body and a heating position in which the plate contacts the heater body. A bonding agent is applied to the polishing block surface. The polishing block is placed on the buffer plate when the buffer plate is positioned in the pre-heating position and the buffer plate is moved from the pre-heating position to the heating position to heat the buffer plate, the polishing block and the bonding agent.

Abstract: A method for detecting the presence of infertility in mammalian male test subjects based upon failure of sperm to undergo successful capacitation. Sperm samples are given the opportunity to undergo capacitation and subsequently contacted with antibodies to polypeptides having an amino acid sequence tripeptide of Arginine-Glycine-Aspartate in their cell binding domains. Binding levels indicate the degree of capacitation and consequently the presence of infertility.

Abstract: A method for detecting the presence of infertility in mammalian male animals based upon failure of sperm to undergo successful capacitation. Sperm samples are given the opportunity to undergo capacitation and subsequently contacted with antibodies to fibronectin. Binding levels indicate the degree of capacitation and consequently the presence of infertility.