Abstract: A system for assembling electronic circuits on an electrically non-conductive surface or substrate. The system incorporates electronic components integrated into electronic component modules. The electronic component modules include identification markings on the top surfaces and electronic contact pads on the bottom surfaces. Electrical interconnects between discrete electronic component modules is achieved through the use of electrically conductive traces placed on the substrate surface. The bottom surfaces of the electronic component modules are coated with an adhesive so the electronic component modules can be mounted onto the substrate. The electronic component modules are affixed to the substrate such that the electronic component modules contact pads make electrical contact with the appropriate electrically conductive traces.