Patents by Inventor Richard Anthony Eddins
Richard Anthony Eddins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230420901Abstract: The disclosure relates to an apparatus for connecting an electronic component to a conductor. A housing includes at least one slot and defines at least one component chamber for carrying the electronic component. A liquid coolant can pass through the housing. A pair of conductive members extends from the housing through the at least one slot and can be releasably inserted into a channel defined in a support assembly. The support assembly facilitates an electrical connection between the conductive members and corresponding conductive contact members connected to a respective power supply or electrical load. The support assembly can provide an inward sealing force to a seal on the housing circumscribing the pair of conductive members.Type: ApplicationFiled: June 22, 2022Publication date: December 28, 2023Inventors: Christopher James Kapusta, David Richard Esler, Arun Virupaksha Gowda, Brian Magann Rush, Liang Yin, Richard Anthony Eddins, Liqiang Yang, Judd Everett Swanson
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Publication number: 20230378725Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.Type: ApplicationFiled: August 2, 2023Publication date: November 23, 2023Inventors: Liqiang Yang, Richard Anthony Eddins, Robert Lloyd George, Darrell Lee Grimes
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Publication number: 20230361049Abstract: A modular POL component can be arranged to define a half-bridge converter topology, and can be coupled with other modular POL power components to define a full-bridge or 3-phase AC converter topology based on a desired power output. The assembled POL components can be mounted on a common electrically insulative substrate to define a POL power conversion device to provide the desired power output.Type: ApplicationFiled: May 6, 2022Publication date: November 9, 2023Inventors: Liqiang Yang, Darrell Lee Grimes, Richard Anthony Eddins, Shung Ik Lee, Judd Everett Swanson
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Patent number: 11757264Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.Type: GrantFiled: April 16, 2021Date of Patent: September 12, 2023Assignee: GE Aviation Systems LLCInventors: Liqiang Yang, Richard Anthony Eddins, Robert Lloyd George, Darrell Lee Grimes
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Publication number: 20230114057Abstract: The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.Type: ApplicationFiled: October 12, 2021Publication date: April 13, 2023Inventors: Brian Magann Rush, Christopher James Kapusta, David Richard Esler, Liang Yin, Richard Anthony Eddins, Judd Everett Swanson, Liqiang Yang
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Patent number: 11551993Abstract: A power overlay (POL) module includes a semiconductor device having a first side and an opposing second side, a dielectric sheet having a first side coupled to the semiconductor device second side, and an opposing second side, the dielectric sheet defining an aperture therethrough. The POL module also includes a first conductive layer disposed on the second side of the dielectric sheet and electrically coupled through the aperture to the semiconductor device second surface, a first conductive plate having a first side, and an opposing second side coupled to the first surface of the semiconductor device. The POL module further includes a first heat sink coupled the first side of the conductive plate and a first thermal interface layer disposed between the first conductive plate and the first heat sink.Type: GrantFiled: August 28, 2020Date of Patent: January 10, 2023Assignee: GE Aviation Systems LLCInventors: David Richard Esler, Christopher James Kapusta, Arun V. Gowda, Weijun Yin, Liqiang Yang, Richard Anthony Eddins
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Patent number: 11350545Abstract: An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.Type: GrantFiled: December 5, 2019Date of Patent: May 31, 2022Assignee: GE Aviation Systems LLCInventors: Liqiang Yang, Richard Anthony Eddins, Darrell Lee Grimes, Michel Engelhardt
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Publication number: 20220070996Abstract: A power overlay (POL) module includes a semiconductor device having a first side and an opposing second side, a dielectric sheet having a first side coupled to the semiconductor device second side, and an opposing second side, the dielectric sheet defining an aperture therethrough. The POL module also includes a first conductive layer disposed on the second side of the dielectric sheet and electrically coupled through the aperture to the semiconductor device second surface, a first conductive plate having a first side, and an opposing second side coupled to the first surface of the semiconductor device. The POL module further includes a first heat sink coupled the first side of the conductive plate and a first thermal interface layer disposed between the first conductive plate and the first heat sink.Type: ApplicationFiled: August 28, 2020Publication date: March 3, 2022Inventors: David Richard Esler, Christopher James Kapusta, Arun V. Gowda, Weijun Yin, Liqiang Yang, Richard Anthony Eddins
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Publication number: 20210234343Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.Type: ApplicationFiled: April 16, 2021Publication date: July 29, 2021Inventors: Liqiang Yang, Richard Anthony Eddins, Robert Lloyd George, Darrell Lee Grimes
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Patent number: 11050252Abstract: A power device can include a first conductive terminal, a second conductive terminal, a power overlay having a conductive backplane and solid state switches, and a controller module configured to selectively operate the solid state switches to enable conductive communication between the first conductive terminal and the second conductive terminal.Type: GrantFiled: August 12, 2019Date of Patent: June 29, 2021Assignee: GE AVIATION SYSTEMS LLCInventors: Richard Anthony Eddins, Kenneth Howard Schnorr
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Publication number: 20210176896Abstract: An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.Type: ApplicationFiled: December 5, 2019Publication date: June 10, 2021Inventors: Liqiang Yang, Richard Anthony Eddins, Darrell Lee Grimes, Michel Engelhardt
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Patent number: 10985537Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.Type: GrantFiled: May 3, 2019Date of Patent: April 20, 2021Assignee: GE Aviation Systems LLCInventors: Liqiang Yang, Richard Anthony Eddins, Robert Lloyd George, Darrell Lee Grimes
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Patent number: 10822096Abstract: An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.Type: GrantFiled: March 30, 2018Date of Patent: November 3, 2020Assignee: GE Aviation Systems LLCInventors: Liqiang Yang, Richard Anthony Eddins, Darrell Lee Grimes
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Publication number: 20200091686Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.Type: ApplicationFiled: May 3, 2019Publication date: March 19, 2020Inventors: Liqiang Yang, Richard Anthony Eddins, Robert Lloyd George, Darrell Lee Grimes
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Publication number: 20190363537Abstract: A power device can include a first conductive terminal, a second conductive terminal, a power overlay having a conductive backplane and solid state switches, and a controller module configured to selectively operate the solid state switches to enable conductive communication between the first conductive terminal and the second conductive terminal.Type: ApplicationFiled: August 12, 2019Publication date: November 28, 2019Inventors: Richard Anthony Eddins, Kenneth Howard Schnorr
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Publication number: 20190300180Abstract: An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.Type: ApplicationFiled: March 30, 2018Publication date: October 3, 2019Inventors: Liqiang Yang, Richard Anthony Eddins, Darrell Lee Grimes
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Patent number: 10381833Abstract: A power contactor can include a first conductive terminal, a second conductive terminal, a power overlay having a conductive backplane and solid state switches, and a controller module configured to selectively operate the solid state switches to enable conductive communication between the first conductive terminal and the second conductive terminal.Type: GrantFiled: June 27, 2017Date of Patent: August 13, 2019Assignee: GE AVIATION SYSTEMS LLCInventors: Richard Anthony Eddins, Kenneth Howard Schnorr
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Publication number: 20180375327Abstract: A power contactor can include a first conductive terminal, a second conductive terminal, a power overlay having a conductive backplane and solid state switches, and a controller module configured to selectively operate the solid state switches to enable conductive communication between the first conductive terminal and the second conductive terminal.Type: ApplicationFiled: June 27, 2017Publication date: December 27, 2018Inventors: Richard Anthony Eddins, Kenneth Howard Schnorr