Abstract: An apparatus for testing the attachment reliability of a device mounted at least by an electrically conducting joint to a surface of a circuit board is provided. The apparatus includes an environmental chamber in which the board can be placed; an actuator for applying a force to the device; an electrical monitoring unit for monitoring any events at the electrically conducting joint; and a memory unit for storing an event profile that includes information related to the events. The apparatus may further include a processing unit for characterizing the quality of the electrically conducting joint based on the stored event profile and for performing various other functions. A method for testing the attachment reliability of the device is also provided.

Abstract: Optical fibers (15) are supported within a bonded support member (16) having along opposite sides first and second grooves (14) which are parallel to the central axes of the fibers being supported. A first opening (22) is formed in a holder member (21) which includes a first projection (27). A cantilever spring member (23) is formed in the holder member having a second projection (27) opposite the first projection. The bonded fiber support member (16) is inserted into the opening such that the first projection engages the first groove (14) on one side, and the second projection engages the second groove (14) on the other side of the bonded support member. Thereafter, the bonded support member is locked into position and the holder biases one end of it against a polishing wheel (29) to permit polishing along a plane which is perpendicular to the axes of the optical fibers.

Abstract: A method for interconnecting first and second optical fiber bundles (FIG. 4 ), each bundle comprising a plurality of optical fibers, comprises the steps of accurately forming substantially identical matrix arrays of apertures in first and second thin securing plates (FIG. 1, 20, 17). The use of thin plates for the securing plate makes it possible to form apertures by masking and etching with great precision, but the plates themselves have little mechanical strength. The first and second plates are aligned (by balls 24), and a first support member (31), which is mechanically rugged, is simultaneously contacted to the first securing plate (17) and to a first alignment pin (27). The first support member (31) is bonded to the first securing plate while the first securing plate (17) is in alignment with the second securing plate (20).

Abstract: A bundle (12) of optical fibers (13) is fixed in a matrix array by apertures in a guiding plate (14) and a securing plate (15). The apertures (18) in the guiding plate are larger than those in the securing plate and the securing plate apertures (17) are funnel-shaped to aid in insertion of the fibers. Each row of optical fibers may be inserted simultaneously by mounting the row on a uniquely designed vacuum holder (26).

Abstract: A bundle (12) of optical fibers (13) is fixed in a matrix array by apertures in a guiding plate (14) and a securing plate (15). The apertures (18) in the guiding plate are larger than those in the securing plate and the securing plate apertures (17) are funnel-shaped to aid in insertion of the fibers. Each row of optical fibers may be inserted simultaneously by mounting the row on a uniquely designed vacuum holder (26).