Patents by Inventor Richard C. Fovell
Richard C. Fovell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11915850Abstract: A coil assembly for controlling a magnetic field in a plasma chamber is provided herein. In some embodiments, the coil assembly may include a mandrel including an annular body that includes at least one upper body coolant channel and at least one lower body coolant channel, and a plurality of cooling fins disposed circumferentially about an outer diameter of the body and radially outward from the outer diameter, an inner electromagnetic cosine-theta (cos ?) coil ring including a first set of inner coils wrapped around the plurality of cooling fins in the body and configured to generate a magnetic field in a first direction, an outer electromagnetic cosine-theta (cos ?) coil ring including a second set of outer coils wrapped around the plurality of cooling fins and configured to generate a magnetic field in a second direction orthogonal to the first direction.Type: GrantFiled: December 20, 2017Date of Patent: February 27, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Richard C. Fovell, Kartik Ramaswamy, Larry D. Elizaga
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Patent number: 11881384Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.Type: GrantFiled: September 27, 2019Date of Patent: January 23, 2024Assignee: Applied Materials, Inc.Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Vladimir Knyazik, Philip Allan Kraus, Thai Cheng Chua
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Patent number: 11670489Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.Type: GrantFiled: June 17, 2021Date of Patent: June 6, 2023Assignee: Applied Materials, Inc.Inventors: Joseph F. AuBuchon, James Carducci, Larry D. Elizaga, Richard C. Fovell, Philip Allan Kraus, Thai Cheng Chua
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Publication number: 20230135935Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.Type: ApplicationFiled: December 15, 2022Publication date: May 4, 2023Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Thai Cheng Chua, Philip Allan Kraus
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Patent number: 11564292Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.Type: GrantFiled: September 27, 2019Date of Patent: January 24, 2023Assignee: Applied Materials, Inc.Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Thai Cheng Chua, Philip Allan Kraus
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Publication number: 20210313153Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.Type: ApplicationFiled: June 17, 2021Publication date: October 7, 2021Inventors: Joseph F. AuBuchon, James Carducci, Larry D. Elizaga, Richard C. Fovell, Philip Allan Kraus, Thai Cheng Chua
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Patent number: 11049694Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.Type: GrantFiled: September 27, 2019Date of Patent: June 29, 2021Assignee: Applied Materials, Inc.Inventors: Joseph F. AuBuchon, James Carducci, Larry D. Elizaga, Richard C. Fovell, Philip Allan Kraus, Thai Cheng Chua
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Publication number: 20210100076Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.Type: ApplicationFiled: September 27, 2019Publication date: April 1, 2021Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Thai Cheng Chua, Philip Allan Kraus
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Publication number: 20210098231Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.Type: ApplicationFiled: September 27, 2019Publication date: April 1, 2021Inventors: James Carducci, Richard C. Fovell, Larry D. Elizaga, Silverst Rodrigues, Vladimir Knyazik, Philip Allan Kraus, Thai Cheng Chua
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Publication number: 20210098236Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.Type: ApplicationFiled: September 27, 2019Publication date: April 1, 2021Inventors: Joseph F. AuBuchon, James Carducci, Larry D. Elizaga, Richard C. Fovell, Philip Allan Kraus, Thai Cheng Chua
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Publication number: 20190189330Abstract: A coil assembly for controlling a magnetic field in a plasma chamber is provided herein. In some embodiments, the coil assembly may include a mandrel including an annular body that includes at least one upper body coolant channel and at least one lower body coolant channel, and a plurality of cooling fins disposed circumferentially about an outer diameter of the body and radially outward from the outer diameter, an inner electromagnetic cosine-theta (cos ?) coil ring including a first set of inner coils wrapped around the plurality of cooling fins in the body and configured to generate a magnetic field in a first direction, an outer electromagnetic cosine-theta (cos ?) coil ring including a second set of outer coils wrapped around the plurality of cooling fins and configured to generate a magnetic field in a second direction orthogonal to the first direction.Type: ApplicationFiled: December 20, 2017Publication date: June 20, 2019Inventors: RICHARD C. FOVELL, KARTIK RAMASWAMY, LARRY D. ELIZAGA
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Patent number: 4960569Abstract: A corona discharge ozonator is provided that comprises a first electrode, a second electrode and a dielectric material disposed between the electrodes. An ozonization chamber is formed between one of the electrodes and the dielectric material and defines a fluid flow path. A plurality of thermally-conducting solids are within the fluid flow path. Substantially each of the solids touches another of the solids and either the dielectric material or the first or second electrode. These solids transfer heat from the hotter to the cooler of the dielectric and the first or second electrode when one of the electrodes is cooled by a conventional means such as a water bath. Corona discharge ozonators of the invention have improved ozone output and increased ozone production energy efficiency.Type: GrantFiled: November 14, 1988Date of Patent: October 2, 1990Assignee: Alten CorporationInventors: Richard C. Fovell, Jan M. Heinemann, Klaus W. Heinemann