Abstract: A component extracting tool extracts larger electronic components and components difficult to remove from a circuit board such as pin grid array type electronic components, hybrid components and daughter boards. The tool is constructed with compressable and releasable handles which are compressable through first and second stages of tool action. Opposing grasping elements are operatively coupled to the handles for movement of the opposing grasping elements toward each other for grasping a component to be extracted upon initially compressing the handles through the first stage of tool action. Bracing elements abut against the circuit board from which a component is to be extracted and the bracing elements and grasping elements are mounted on the handles for extending and retracting movement relative to each other.