Patents by Inventor Richard Christopher Stamey

Richard Christopher Stamey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid microelectronic substrates
    Patent number: 11923257
    Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: March 5, 2024
    Assignee: Intel Corporation
    Inventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard Christopher Stamey, Amruthavalli Pallavi Alur
  • HYBRID MICROELECTRONIC SUBSTRATES
    Publication number: 20210384094
    Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.
    Type: Application
    Filed: August 19, 2021
    Publication date: December 9, 2021
    Applicant: Intel Corporation
    Inventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard Christopher Stamey, Amruthavalli Pallavi Alur
  • Hybrid microelectronic substrates
    Patent number: 11114353
    Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: September 7, 2021
    Assignee: Intel Corporation
    Inventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard Christopher Stamey, Amruthavalli Pallavi Alur
  • HYBRID MICROELECTRONIC SUBSTRATES
    Publication number: 20190057915
    Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.
    Type: Application
    Filed: March 30, 2016
    Publication date: February 21, 2019
    Applicant: Intel Corporation
    Inventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard Christopher Stamey, Amruthavalli Pallavi Alur