Patents by Inventor Richard David Neufeld
Richard David Neufeld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9634224Abstract: In one aspect, fabricating a superconductive integrated circuit with a Josephson junction includes applying oxygen or nitrogen to at least part of a structure formed from an outer superconductive layer to passivate an artifact, if any, left from removing the portion of the outer superconductive layer. In another aspect, a first superconductive layer is deposited, a second superconductive layer is deposited on the first superconductive layer, an oxide layer is formed on the first superconductive layer, a dielectric layer is deposited on the oxide layer, a portion of the dielectric layer is removed, a first portion of the oxide layer is removed, a second oxide portion is formed in place of the first portion of the oxide layer, and a third superconductive layer is deposited on the dielectric layer and the second oxide portion.Type: GrantFiled: January 20, 2015Date of Patent: April 25, 2017Assignee: D-Wave Systems Inc.Inventors: Eric Ladizinsky, Nicolas Ladizinsky, Jason Yao, Byong Hyop Oh, Richard David Neufeld
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Patent number: 9231181Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.Type: GrantFiled: August 28, 2012Date of Patent: January 5, 2016Assignee: D-Wave Systems Inc.Inventors: Murray C. Thom, Alexander M. Tcaciuc, Gordon Lamont, Jacob Craig Petroff, Richard David Neufeld, David S. Bruce, Sergey V. Uchaykin
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Patent number: 9170278Abstract: A system may include first and second qubits that cross one another and a first coupler having a perimeter that encompasses at least a part of the portions of the first and second qubits, the first coupler being operable to ferromagnetically or anti-ferromagnetically couple the first and the second qubits together. A multi-layered computer chip may include a first plurality N of qubits laid out in a first metal layer, a second plurality M of qubits laid out at least partially in a second metal layer that cross each of the qubits of the first plurality of qubits, and a first plurality N times M of coupling devices that at least partially encompasses an area where a respective pair of the qubits from the first and the second plurality of qubits cross each other.Type: GrantFiled: May 8, 2014Date of Patent: October 27, 2015Assignee: D-Wave Systems Inc.Inventor: Richard David Neufeld
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Publication number: 20150263260Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.Type: ApplicationFiled: August 28, 2012Publication date: September 17, 2015Applicant: D-WAVE SYSTEMS INC.Inventors: Murray C. Thom, Alexander M. Tcaciuc, Gordon Lamont, Jacob Craig Petroff, Richard David Neufeld, David S. Bruce, Sergey V. Uchaykin
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Publication number: 20150236235Abstract: In one aspect, fabricating a superconductive integrated circuit with a Josephson junction includes applying oxygen or nitrogen to at least part of a structure formed from an outer superconductive layer to passivate an artifact, if any, left from removing the portion of the outer superconductive layer. In another aspect, a first superconductive layer is deposited, a second superconductive layer is deposited on the first superconductive layer, an oxide layer is formed on the first superconductive layer, a dielectric layer is deposited on the oxide layer, a portion of the dielectric layer is removed, a first portion of the oxide layer is removed, a second oxide portion is formed in place of the first portion of the oxide layer, and a third superconductive layer is deposited on the dielectric layer and the second oxide portion.Type: ApplicationFiled: January 20, 2015Publication date: August 20, 2015Inventors: Eric Ladizinsky, Nicolas Ladizinsky, Jason Yao, Byong Hyop Oh, Richard David Neufeld
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Publication number: 20140329687Abstract: A system may include first and second qubits that cross one another and a first coupler having a perimeter that encompasses at least a part of the portions of the first and second qubits, the first coupler being operable to ferromagnetically or anti-ferromagnetically couple the first and the second qubits together. A multi-layered computer chip may include a first plurality N of qubits laid out in a first metal layer, a second plurality M of qubits laid out at least partially in a second metal layer that cross each of the qubits of the first plurality of qubits, and a first plurality N times M of coupling devices that at least partially encompasses an area where a respective pair of the qubits from the first and the second plurality of qubits cross each other.Type: ApplicationFiled: May 8, 2014Publication date: November 6, 2014Applicant: D-Wave Systems Inc.Inventors: Paul Bunyk, Richard David Neufeld, Felix Maibaum
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Patent number: 8421053Abstract: A system may include first and second qubits that cross one another and a first coupler having a perimeter that encompasses at least a part of the portions of the first and second qubits, the first coupler being operable to ferromagnetically or anti-ferromagnetically couple the first and the second qubits together. A multi-layered computer chip may include a first plurality N of qubits laid out in a first metal layer, a second plurality M of qubits laid out at least partially in a second metal layer that cross each of the qubits of the first plurality of qubits, and a first plurality N times M of coupling devices that at least partially encompasses an area where a respective pair of the qubits from the first and the second plurality of qubits cross each other.Type: GrantFiled: March 23, 2009Date of Patent: April 16, 2013Assignee: D-Wave Systems Inc.Inventors: Paul Bunyk, Richard David Neufeld, Felix Maibaum
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Publication number: 20130005580Abstract: A system may include first and second qubits that cross one another and a first coupler having a perimeter that encompasses at least a part of the portions of the first and second qubits, the first coupler being operable to ferromagnetically or anti-ferromagnetically couple the first and the second qubits together. A multi-layered computer chip may include a first plurality N of qubits laid out in a first metal layer, a second plurality M of qubits laid out at least partially in a second metal layer that cross each of the qubits of the first plurality of qubits, and a first plurality N times M of coupling devices that at least partially encompasses an area where a respective pair of the qubits from the first and the second plurality of qubits cross each other.Type: ApplicationFiled: September 12, 2012Publication date: January 3, 2013Applicant: D-WAVE SYSTEMS INC.Inventors: Paul Bunyk, Richard David Neufeld, Felix Maibaum
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Patent number: 8279022Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.Type: GrantFiled: July 15, 2009Date of Patent: October 2, 2012Assignee: D-Wave Systems Inc.Inventors: Murray C. Thom, Alexander M. Tcaciuc, Gordon Lamont, Jacob Craig Petroff, Richard David Neufeld, David S. Bruce, Sergey V. Uchaykin
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Publication number: 20110022820Abstract: A system may include first and second qubits that cross one another and a first coupler having a perimeter that encompasses at least a part of the portions of the first and second qubits, the first coupler being operable to ferromagnetically or anti-ferromagnetically couple the first and the second qubits together. A multi-layered computer chip may include a first plurality N of qubits laid out in a first metal layer, a second plurality M of qubits laid out at least partially in a second metal layer that cross each of the qubits of the first plurality of qubits, and a first plurality N times M of coupling devices that at least partially encompasses an area where a respective pair of the qubits from the first and the second plurality of qubits cross each other.Type: ApplicationFiled: March 23, 2009Publication date: January 27, 2011Applicant: D-WAVE SYSTEMS INC.Inventors: Paul Bunyk, Richard David Neufeld, Felix Maibaum
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Publication number: 20100157552Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.Type: ApplicationFiled: July 15, 2009Publication date: June 24, 2010Inventors: Murray C. Thom, Alexander M. Tcaciuc, Gordon Lamont, Jacob Craig Petroff, Richard David Neufeld, David S. Bruce, Sergey V. Uchaykin
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Patent number: 6753664Abstract: In accordance with the present invention, the control over a high- speed non-linear actuator is improved by linearizing the relationship between the actuating impetus and the feedback control signal via a method that employs the separate and concurrent control of the static and dynamic characteristics of the device without resorting to the use of force-feedback or field-strength feedback. The resonant frequency of the plunger of the actuator is manipulated during operation such as to maintain it at a substantially fixed optimal value. The method is particularly advantageous in devices where space is at a premium and force-feedback or field-strength feedback mechanisms are difficult to implement.Type: GrantFiled: March 22, 2001Date of Patent: June 22, 2004Assignee: Creo Products Inc.Inventors: Richard David Neufeld, Christopher Earl Trautman
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Publication number: 20020135329Abstract: In accordance with the present invention, the control over a high- speed non-linear actuator is improved by linearizing the relationship between the actuating impetus and the feedback control signal via a method that employs the separate and concurrent control of the static and dynamic characteristics of the device without resorting to the use of force-feedback or field-strength feedback. The resonant frequency of the plunger of the actuator is manipulated during operation such as to maintain it at a substantially fixed optimal value. The method is particularly advantageous in devices where space is at a premium and force-feedback or field-strength feedback mechanisms are difficult to implement.Type: ApplicationFiled: March 22, 2001Publication date: September 26, 2002Inventors: Richard David Neufeld, Christopher Earl Trautman