Abstract: An ultrasound transducer (10) comprises an application specific integrated circuit (ASIC) (14), an array of acoustic elements (20), and a pitch independent interposer (12). The ASIC (14) includes a plurality of contact pads (16) on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements (22) of the array (20) are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer (12) features a plurality of conductive elements (26) separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch.

Abstract: An acoustic assembly that includes an integrated circuit package having an electrically conductive via configured to pass from an active portion of the integrated circuit package through a bottom portion of the integrated circuit package. The bottom portion is a bottom side of a substrate of the integrated circuit package. An acoustic element is positioned on the bottom side of the substrate and the via is arranged to electrically couple the active portion of the integrated circuit package to the acoustic element. In one embodiment, the acoustic element is an acoustic stack and the integrated circuit package is an ASIC. The assembly microbeamformed transducer.

Abstract: An ultrasound transducer 10 comprises an application specific integrated circuit (ASIC) 14, an array of acoustic elements 20, and a pitch independent interposer 12. The ASIC 14 includes a plurality of contact pads 16 on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements 22 of the array 20 are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer 12 features a plurality of conductive elements 26 separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch.

Abstract: An acoustic assembly that includes an integrated circuit package having an electrically conductive via configured to pass from an active portion of the integrated circuit package through a bottom portion of the integrated circuit package. The bottom portion is a bottom side of a substrate of the integrated circuit package. An acoustic element is positioned on the bottom side of the substrate and the via is arranged to electrically couple the active portion of the integrated circuit package to the acoustic element. In one embodiment, the acoustic element is an acoustic stack and the integrated circuit package is an ASIC. The assembly microbeamformed transducer.

Abstract: A method and apparatus are described for harmonic imaging using a transducer operated in the k31 mode. In one embodiment, the invention includes a transducer operative in a k31 mode, a transmitter for transmitting first signals to the transducer assembly, and a receiver for processing second signals received by the transducer assembly at a harmonic of the frequency of the first signals. In another embodiment, a method of operating an ultrasound system includes emitting first signals in a first frequency range from a transducer operating in the k31 mode, projecting the signals into a body, and detecting second signals confined to a second frequency range.

Abstract: Soft tissue examination apparatus and method employ an ultrasonic transducer system for generating a series of ultrasound pulses, at least one of which is of sufficiently high intensity to induce physical displacement of the soft tissue. The transducer receives a series of ultrasonic echo pulses and responsively generates a series of data signals indicative of such tissue displacement. A data processor receives the data signals and determines the magnitude of the displacement. In such a manner, the present invention assists in the evaluation and/or diagnosis of biological tissue. Preferably, the apparatus and method of this invention is employed to examine the properties of a subject's vitreous body and thus may be used in the evaluation and/or diagnosis of ocular disorders, such as vitreous traction.

Abstract: An ultrasonic transducer assembly is disclosed having both transmit and receive circuitry integral to the transducer assembly for generating and receiving ultrasonic pulses. The ultrasonic transducer array which is integral with the transducer assembly preferably includes multi-layer transducer elements as transmit elements of the array and may include single layer transducer elements as receive elements. Also disclosed is an ultrasonic scanner utilizing the transducer assembly with integral transmit and receive circuitry to reduce the amount and complexity of interconnections between the transducer assembly and a scanner rack.