Patents by Inventor Richard E. Flaig

Richard E. Flaig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8864500
    Abstract: An electronic module for a computer system comprises a first circuit board having a plurality of edge connectors configured to releasably connect to electrical contacts of a computer system socket, a second circuit board having a plurality of contacts configured to connect with a plurality of electrical components, and a flexible portion having electrical conduits to provide electrical connection between the plurality of edge connectors and the plurality of contacts. The flexible portion further includes an electrically conductive layer extending across a region of the flexible portion. The electrically conductive layer is superposed with the electrical conduits and separated from electrical conduits by a dielectric layer.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: October 21, 2014
    Assignee: Netlist, Inc.
    Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig
  • Patent number: 8287291
    Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: October 16, 2012
    Assignee: Netlist Inc.
    Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig
  • Patent number: 8033836
    Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: October 11, 2011
    Assignee: Netlist, Inc.
    Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig
  • Patent number: 7811097
    Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: October 12, 2010
    Assignee: Netlist, Inc.
    Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig
  • Patent number: 7442050
    Abstract: A circuit card includes a rigid portion having a first plurality of contacts configured to be in electrical communication with a plurality of memory devices. The circuit card further includes a flexible connector coupled to the rigid portion. The flexible connector has a first side and a second side. The flexible connector comprises a dielectric layer, a second plurality of contacts configured to be in electrical communication with a substrate, and a plurality of electrical conduits on the first side of the flexible connector and extending from the rigid portion to the second plurality of contacts. The plurality of electrical conduits is in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible connector further includes an electrically conductive layer on the second side of the flexible connector.
    Type: Grant
    Filed: August 28, 2006
    Date of Patent: October 28, 2008
    Assignee: Netlist, Inc.
    Inventors: Jayesh R. Bhakta, Enchao Yu, Chi She Chen, Richard E. Flaig