Abstract: A process for making a latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers and liquid removal of these layers in order to also provide needed permanent physical protection for an ultra fragile switch moving arm member. Latched operation of the achieved MEMS switch without use of conventional holding electrodes or magnetic fields is also achieved. Fabrication of a single MEMS switch is disclosed however large or small arrays may be achieved. A liquid removal based fabrication process is disclosed.

Abstract: A latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers and liquid removal of these layers in order to also provide needed permanent physical protection for an ultra fragile switch moving arm member. Latched operation of the achieved MEMS switch without use of conventional holding electrodes or magnetic fields is also achieved. Fabrication of a single MEMS switch is disclosed however large or small arrays may be achieved.

Abstract: A digital variable capacitor package is provided as having a ground plane disposed on predetermined portion of the top surface of a substrate. An elongated signal electrode may also be disposed on the substrate and including a first end defining an input and a second end extending to a substantially central region of the top surface of the substrate. This elongated signal electrode is disposed to be electrically isolated from the ground plane. A number of elongated cantilevers are disposed on the substrate and each include first ends coupled to the second end of the signal electrode and each further include second ends suspended over different predetermined portions of the ground plane. In operation, one or more of the cantilevers may be actuated to move portion thereof into close proximity to the ground plane for providing one or more discrete capacitance values.

Abstract: A capacitance coupled, transmission line-fed, radio frequency MEMS switch and its fabrication process using photoresist and other low temperature processing steps are described. The achieved switch is disposed in a low cost dielectric housing free of undesired electrical effects on the switch and on the transmission line(s) coupling the switch to an electrical circuit. The dielectric housing is provided with an array of sealable apertures useful for wet, but hydrofluoric acid-free, removal of switch fabrication employed materials and also useful during processing for controlling the operating atmosphere surrounding the switch—e.g. at a pressure above the high vacuum level for enhanced switch damping during operation. Alternative arrangements for sealing an array of dielectric housing apertures are included. Processing details including plan and profile drawing views, specific equipment and materials identifications, temperatures and times are also disclosed.

Abstract: A capacitance coupled, transmission line-fed, radio frequency MEMS switch and its fabrication process using photoresist and other low temperature processing steps are described. The achieved switch is disposed in a low cost dielectric housing free of undesired electrical effects on the switch and on the transmission line(s) coupling the switch to an electrical circuit. The dielectric housing is provided with an array of sealable apertures useful for wet, but hydrofluoric acid-free, removal of switch fabrication employed materials and also useful during processing for controlling the operating atmosphere surrounding the switch—e.g. at a pressure above the high vacuum level for enhanced switch damping during operation. Alternative arrangements for sealing an array of dielectric housing apertures are included. Processing details including plan and profile drawing views, specific equipment and materials identifications, temperatures and times are also disclosed.

Abstract: A micromechanical electrical systems (MEMS) metallic micromachined multiple ported electrical switch receivable on the die of an integrated circuit and within the integrated circuit package for controlling radio frequency signal paths among a plurality of switch-enabled different path choices. The switch provides desirably small signal losses in both the switch open and switch closed conditions. The switch is primarily of the single pole multiple throw mechanical type with possible use as a single input pole, multiple output poles device and provision for grounding open nodes in the interest of limiting capacitance coupling across the switch in its open condition. Cantilever beam switch element suspension is included along with normally open and normally closed switch embodiments, electrostatic switch actuation and signal coupling through the closed switch by way of increased inter electrode capacitance coupling. Switch operation from direct current to a frequency above ten gigahertz is accommodated.

Abstract: A micromechanical electrical systems (MEMS) metallic micromachined electrical switch usable on the die of an integrated circuit and inside the integrated circuit package for controlling radio frequency signal paths while incurring desirably small signal losses. The switch is of the single pole single throw mechanical type with provision for grounding one open-switch position node in the interest of limiting capacitance coupling across the switch in its open condition. Cantilever beam switch element suspension is included along with normally open and normally closed switch embodiments, electrostatic switch actuation and signal coupling through the closed switch by way of capacitance coupling. Low loss radio frequency operation above one gigahertz in frequency is provided.