Abstract: A method is disclosed for scribing chemical milling maskant applied to a metal substrate by impinging a laser beam on the maskant and controlling the beam to penetrate through the maskant substantially without damaging the underlying metal. In carrying out the process, a metal part such as aluminum, titanium or their alloys is coated with an organic polymer maskant having absorption to a laser beam, a predetermined pattern is scribed in the maskant by impinging a laser beam, e.g. a Nd:YAG (neodymium doped yttrium aluminum garnet) laser, under controlled conditions to scribe a predetermined pattern in the maskant and substantially without damaging the underlying metal, removing the maskant portion within the circumscribed area of the pattern to expose the underlying metal and leaving the remaining maskant portion adhered to the substrate, immersing the metal substrate in a chemical milling solution, e.g.