Abstract: A device including a first circuit operable to perform a first function, and a second circuit operable to perform a second function. The second circuit includes a male port connector, a port replicator chip, and a female port connector. In one embodiment, the first circuit includes one or more semiconductor devices adapted to store information. In another embodiment, the first circuit includes one or more semiconductor devices adapted to print information. In still another embodiment, the first circuit includes one or more semiconductor devices adapted to input information, such as a keyboard, a game pad, or a joy stick. The male port connector is adapted to connect to a port on a host computer. The female port connector is adapted to receive another male port connector.

Abstract: A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a plurality of separate devices.

Abstract: A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

Abstract: A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

Abstract: A method for constructing a dual sided integrated circuit chip package. A leadframe is formed comprising a set of die pads, and a set of lead fingers corresponding to each die pad. An integrated circuit die is disposed onto a first side and a second side of each die pad. Each integrated circuit die is wire bonded to the corresponding lead fingers. The temperature during the second side die attach and wire bonding steps is controlled and/or compatible materials are selected to prevent warping of the leadframe, and special steps are also implemented to eliminate mold flash, plastic mold cracking and overcuring and increasing the adhesion.