Abstract: An elongated biometric device provides a slim solution for capturing biometric data, and may be placed on a portion of an electronic device having limited space, such as a side of the electronic device. The elongated biometric device may include a force sensor, which may be positioned within a housing of the electronic device and actuated through posts extending from the elongated biometric device through the housing to transfer an applied force to the force sensor.

Abstract: A device placement or diebonding head for a diebonding apparatus including a chamber with openings in its end walls, a rod-and-piston combination extending through the chamber with the rod ends protruding through the openings, a gas inlet port into the chamber above or below the piston, and gas pressure resisting means to resist movement of said piston in response to gas pressure. The diebonding head rod has an axial bore therethrough. Its upper end is configured for connection to a vacuum source and its placement end is configured for mounting of a vacuum tool. Thus, force exerted by the rod placement end on a device being diebonded is adjustable by adjusting the gas pressure relative to the resisting means force. The gas inlet may be above or below the piston. The resisting means may be a helical spring in the same or the opposite end of the chamber as the gas inlet. Alternatively, the resisting means may be pressure from gas entering the opposite end of the chamber from the first gas inlet port.

Abstract: A solder geometry for epi-down diebonding an optoelectronic component to a heat sink platform includes a solder deposition pattern having exposure windows to create gaps or diebond bridges in the solder pattern. The active regions of the components are disposably registered within the gaps of the solder pattern.