Patents by Inventor Richard Hengst

Richard Hengst has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor processing components and semiconductor processing utilizing same
    Publication number: 20060046450
    Abstract: A semiconductor processing component includes a substrate and a layer overlying the substrate. The layer has a composition ReAyO1.5+2y, wherein Re is Y, La, a Lanthanoid series element, or a combination thereof, A is (Si1?aGea), 0.25?y?1.2, and 0?a?1.
    Type: Application
    Filed: August 23, 2005
    Publication date: March 2, 2006
    Applicant: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
    Inventors: Yeshwanth Narendar, Matthew Simpson, Richard Hengst