Patents by Inventor Richard Hung Dinh

Richard Hung Dinh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular molded interconnect devices
    Patent number: 8981245
    Abstract: A switching subassembly includes a modular molded interconnect bracket and a switching device arranged on the modular molded interconnect bracket. The modular molded interconnect includes at least one electronic circuit trace arranged thereon configured to interconnect a portion of a flexible printed circuit board and to support a portion of the flexible printed circuit board. The switching device is configured to contact portions of the at least one electronic circuit trace.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: March 17, 2015
    Inventors: Richard Hung Dinh, Shayan Malek, Michael Benjamin Wittenberg
  • MODULAR MOLDED INTERCONNECT DEVICES
    Publication number: 20130327621
    Abstract: A switching subassembly includes a modular molded interconnect bracket and a switching device arranged on the modular molded interconnect bracket. The modular molded interconnect includes at least one electronic circuit trace arranged thereon configured to interconnect a portion of a flexible printed circuit board and to support a portion of the flexible printed circuit board. The switching device is configured to contact portions of the at least one electronic circuit trace.
    Type: Application
    Filed: September 4, 2012
    Publication date: December 12, 2013
    Applicant: Apple Inc.
    Inventors: Richard Hung Dinh, Shayan Malek, Michael Benjamin Wittenberg