Abstract: A progressive press for loading or reloading ammunition casings has a base containing a reversible press motor with speed control, and vertically-oriented nuts mechanically connected to the motor and having vertically-oriented power screws extending from the nuts. The screws are affixed to a tool head which can receive dies and other tools for loading and/or reloading ammunition casings. A rotatable shell plate receives ammunition casings and advances the casings through a series of operations performed by different dies and other tools. Using a control system, the press motor can be operated to extend the screws and lift the tool head when the shell plate is advanced, and to retract the screws and tool head to perform operations on the casings when the shell plate is stationary.

Abstract: Apparatus and associated methods relate to a flexible high-temperature-tolerant RFID tag having an RFID integrated packaged in an SOT package attached with a high temperature solder to a flex circuit defining an RFID antenna. In an illustrative embodiment, the flexible high-temperature-tolerant RFID tag may be encapsulated in a flexible material. For example, the SOT packaged RFID integrated circuit may be encapsulated in rubber. In some embodiments the entire assembled RFID tag may be encapsulated in rubber or another flexible compound. In some embodiments, such flexible high-temperature-tolerant RFID tags may be advantageously used in high-temperature applications. In an exemplary embodiment, flexible high-temperature-tolerant RFID tags may be attached to products that may be flexible and/or deformable. In an exemplary embodiment, a flexible high-temperature-tolerant RFID tag may be molded into a rubber that will be used in a flexible application.

Abstract: Apparatus and associated methods relate to a flexible high-temperature-tolerant RFID tag having an RFID integrated packaged in an SOT package attached with a high temperature solder to a flex circuit defining an RFID antenna. In an illustrative embodiment, the flexible high-temperature-tolerant RFID tag may be encapsulated in a flexible material. For example, the SOT packaged RFID integrated circuit may be encapsulated in rubber. In some embodiments the entire assembled RFID tag may be encapsulated in rubber or another flexible compound. In some embodiments, such flexible high-temperature-tolerant RFID tags may be advantageously used in high-temperature applications. In an exemplary embodiment, flexible high-temperature-tolerant RFID tags may be attached to products that may be flexible and/or deformable. In an exemplary embodiment, a flexible high-temperature-tolerant RFID tag may be molded into a rubber that will be used in a flexible application.