Abstract: A leadless component socket comprises a one- or two-piece leadless component contact socket assembly having a plurality of holes with a respective plurality of spring contacts disposed therein. The socket assembly includes a finger slot or slots to facilitate the manual removal of a chip carrier from the socket and a bias clip and integral keyed corner for assuring proper alignment of the chip carrier with the contacts of the socket assembly. The socket further comprises a cover, a cover support, an insulator assembly and a backup plate or other fastening means for supporting the socket on a printed circuit board. The socket assembly can be configured with a variety of contact terminal ends adapted for a desired mode of circuit board interface. A variety of cover configurations are also accommodated and disclosed.

Abstract: An electronic memory module socket is provided in which a memory module is easily insertable into and removable from the socket, and once inserted is locked into position for good mechanical retension of the module and proper electrical contact between socket contacts and module contacts. Locking-arms disposed at respective ends of the socket cooperate with openings in the memory module's circuit board to lock the module into the socket body. Detents are provided at respective ends of the socket body to additionally latch the module.