Patents by Inventor Richard J. Garabedian

Richard J. Garabedian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Suspended-stripline hybrid coupler
    Patent number: 6822532
    Abstract: A suspended stripline device and method for manufacturing thereof. The device includes first and second conductive traces disposed on a dielectric substrate, each of the first and second conductive traces having a first edge and a second edge, and a housing at least partially surrounding the dielectric substrate, wherein the second edge of each of the first and second conductive traces includes at least one outwardly extending protrusion, the size and orientation of which may be selected so as to compensate for unequal even and odd mode propagation velocities through the suspended-stripline device. The device may be packaged by folding solder-coated tabs, provided on the housing, around the dielectric substrate and heating the device such that the solder melts causing the housing to be secured to the substrate.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: November 23, 2004
    Assignee: Sage Laboratories, Inc.
    Inventors: John R. Kane, Richard J. Garabedian
  • Suspended-stripline hybrid coupler
    Publication number: 20040017267
    Abstract: A suspended stripline device and method for manufacturing thereof. The device includes first and second conductive traces disposed on a dielectric substrate, each of the first and second conductive traces having a first edge and a second edge, and a housing at least partially surrounding the dielectric substrate, wherein the second edge of each of the first and second conductive traces includes at least one outwardly extending protrusion, the size and orientation of which may be selected so as to compensate for unequal even and odd mode propagation velocities through the suspended-stripline device. The device may be packaged by folding solder-coated tabs, provided on the housing, around the dielectric substrate and heating the device such that the solder melts causing the housing to be secured to the substrate.
    Type: Application
    Filed: July 29, 2002
    Publication date: January 29, 2004
    Applicant: Sage Laboratories, Inc.
    Inventors: John R. Kane, Richard J. Garabedian