Abstract: A low or zero insertion force connector for mounting integrated circuit (IC) packages or other multiple pin devices to electrical interconnection boards. A base member has a plurality of spring contacts along opposite long sides which are coupled to actuating members. A slide is connected by pin and slot camming means to the actuators so that longitudinal motion of the slide causes lateral motion of the actuators. Movement of the actuators in one direction draws the contacts inwardly to provide a clear path for the IC leads to be inserted adjacent the contacts. A cover is provided upon which the IC is seated and which has tapered openings to receive the IC leads in alignment with the contacts.

Abstract: A carrier socket for leadless chip integrated circuit devices. A flat leadless substrate with a circuit chip thereon is positioned within a housing having spring-loaded contacts mounted therein, each such contact adapted to engage a contact pad on the substrate. A resilient cover engages the housing and holds the substrate against the contacts in a positive manner. The contacts are formed to facilitate electrical connection between the integrated circuit chip and a circuit board. The contacts may be secured to the board by various means such as soldering or planar welding.

Abstract: An electrical interconnection board with lead sockets mounted in plated-through holes therein. The lead sockets are hollow cylindrical elements having a tapered entry opening at one end and a plurality of normally converging flexible fingers at the other end. The lead sockets are force fitted into the plated-through holes in the board with the receptacle end of the socket opening into the component side of the board. The invention is also concerned with the method for mounting lead sockets to electrical interconnection boards.

Abstract: An electrical interconnection board with lead sockets mounted in holes therein. The lead sockets are hollow cylindrical elements having a tapered opening at one end and a plurality of normally converging flexible fingers at the other end. The lead sockets are force fitted into the holes in the board with the receptacle end of the socket opening into the component side of the board. The invention is also concerned with the method for mounting lead sockets to electrical interconnection boards.

Abstract: A dual-in-line programming jumper pin assembly for use with electrical panel boards having dual-in-line arrays of holes therethrough. Jumper pins may be mounted as desired in slots in an insulator having a shape and size similar to the body of a dual-in-line electronic package, for purposes of electrically interconnecting two or more socket contacts mounted in a panel board. Such jumper pins having different configurations may interconnect, among others: two or more adjacent socket contacts in a line; two socket contacts on opposite sides of an array; two adjacent socket contacts with a third on the opposite side of the array; and two adjacent socket contacts with two other adjacent ones on the opposite side of the array. Means are provided on each jumper pin to anchor it firmly within the slots in the insulator. The jumper pins may be employed for interconnecting two or more socket contacts independently of the insulator.

Abstract: A socket for a dual-in-line electronic package. The socket is plugged into a printed circuit board having dual-in-line arrays of holes therethrough, and an electronic package is removably plugged into the socket. Several alternative means are disclosed to prevent undesired wicking of the solder into the socket contact cavities above the holes in the printed circuit board when the socket is wave soldered to the board.