Abstract: A LED module for providing a source of illumination comprises a plurality of LED lamps each having an anode lead and a cathode lead for providing electrical and mechanical connection. The anode lead of each LED lamp is connected to an anode bus bar and the cathode lead of each LED lamp is connected to a cathode bus bar by solderless connection. The bus bars and the leads of each LED lamp may be integral with each other. Alternatively, the bus bars and leads may be non-integral with each other, connected by an interlocking interaction or interference fit between approximately complementary portions of each lead and bus bar. The LED module may accommodate serial electrical interconnection with other LED modules, it may be shaped according to the particular contour or design of an accommodating light assembly, and it may comprise LED lamps placed at arbitrary positions to achieve a predetermined degree of illumination.

Abstract: This technique for assembling a print head for an LED printer has LED dice first assembled into precisely known locations on mounting tiles. A portion of the front face of each tile is left exposed beyond anything mounted on the tile. The tiles are then assembled with these exposed areas on a planar reference on an assembly fixture. Reference surfaces built into the fixture align the edges of the tiles, and hence the LED dice. Finally a mother plate is adhesively bonded onto the backs of the tiles. The adhesive accommodates thickness variations in the mounting tiles, and lack of flatness in the back surfaces of the tiles and the front face of the mother plate. Reference tiles coplanar with the reference plane formed by the front faces of the mounting tiles provide a z axis reference.

Abstract: This technique for assembling a print head for an LED printer has LED dice first assembled into precisely known locations on mounting tiles. A portion of the front face of each tile is left exposed beyond anything mounted on the tile. The tiles are then assembled with these exposed areas on a planar reference on an assembly fixture. Reference surfaces built into the fixture align the edges of the tiles, and hence the LED dice. Finally a mother plate is adhesively bonded onto the backs of the tiles. The adhesive accommodates thickness variations in the mounting tiles, and lack of flatness in the back surfaces of the tiles and the front face of the mother plate. Reference tiles copolanar with the reference plane formed by the front faces of the mounting tiles provide a z axis reference.