Patents by Inventor Richard J. Miller, II

Richard J. Miller, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Glass package that is hermetically sealed with a frit and method of fabrication
    Patent number: 8063560
    Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: November 22, 2011
    Assignee: Corning Incorporated
    Inventors: Bruce G. Aitken, Joel P. Carberry, Steven E. DeMartino, Henry E. Hagy, Lisa A. Lamberson, Richard J. Miller, II, Robert Morena, Joseph F. Schroeder, III, Alexander Streltsov, Sujanto Widjaja
  • Glass package that is hermetically sealed with a frit and method of fabrication
    Patent number: 7602121
    Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: October 13, 2009
    Assignee: Corning Incorporated
    Inventors: Bruce G. Aitken, Joel P. Carberry, Steven E. DeMartino, Henry E. Hagy, Lisa A. Lamberson, Richard J. Miller, II, Robert Morena, Joseph F. Schroeder, III, Alexander Streltsov, Sujanto Widjaja
  • Glass package that is hermetically sealed with a frit and method of fabrication
    Patent number: 7407423
    Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.
    Type: Grant
    Filed: April 13, 2004
    Date of Patent: August 5, 2008
    Assignee: Corning Incorporated
    Inventors: Bruce G. Aitken, Joel P. Carberry, Steven E. DeMartino, Henry E. Hagy, Lisa A. Lamberson, Richard J. Miller, II, Robert Morena, Joseph F. Schroeder, III, Alexander Streltsov, Sujanto Widjaja
  • Glass package that is hermetically sealed with a frit and method of fabrication
    Patent number: 6998776
    Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: February 14, 2006
    Assignee: Corning Incorporated
    Inventors: Bruce G. Aitken, Joel P. Carberry, Steven E. DeMartino, Henry E. Hagy, Lisa A. Lamberson, Richard J. Miller, II, Robert Morena, Joseph F. Schroeder, III, Alexander Streltsov, Sujanto Widjaja