Patents by Inventor Richard J. Sergi

Richard J. Sergi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of generating a leadframe IC package model, a leadframe modeler and an IC design system
    Patent number: 8370777
    Abstract: A method of generating a model of a leadframe IC package, a leadframe modeler and an IC design system are disclosed. In one embodiment the method includes: (1) adding connectivity information to a geometric representation of a leadframe, wherein the connectivity information represents electrical connections between the IC die and leads of the leadframe and (2) formatting the leads to represent BGA point of contacts for the IC die.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: February 5, 2013
    Assignee: LSI Corporation
    Inventors: Donald E. Hawk, Jr., Stephen M. King, Jeffrey M. Klemovage, John J. Krantz, Allen S. Lim, Ashley Rebelo, Richard J. Sergi
  • METHOD OF GENERATING A LEADFRAME IC PACKAGE MODEL, A LEADFRAME MODELER AND AN IC DESIGN SYSTEM
    Publication number: 20100318340
    Abstract: A method of generating a model of a leadframe IC package, a leadframe modeler and an IC design system are disclosed. In one embodiment the method includes: (1) adding connectivity information to a geometric representation of a leadframe, wherein the connectivity information represents electrical connections between the IC die and leads of the leadframe and (2) formatting the leads to represent BGA point of contacts for the IC die.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 16, 2010
    Applicant: LSI Corporation
    Inventors: Donald E. Hawk, JR., Stephen M. King, Jeffrey M. Klemovage, John J. Krantz, Allen S. Lim, Ashley Rebelo, Richard J. Sergi